Technology, Process and Cost Comparison
Automotive ADAS Vision SoC Comparison
By Yole SystemPlus —
Full physical, cost analysis and comparison among seven automotive Advanced Driver Assistance Systems central system and camera Systems-on-Chips
SPR23654
Overview / Introduction
- Executive Summary
- SoC List & Overview
- Reverse Costing Methodology
- Glossary
Company Profile
- Huawei / HiSilicon
- NVIDIA
- Mobileye
- Tesla
- Renesas
- Xilinx
- Market analysis
Physical Analysis
- HiSilicon Ascend 610
- NVIDIA ORIN
- Mobileye Eye Q5H
- Mobileye Eye Q5M
- Tesla FSD Chip
- Renesas R-Car V3H
- Xilinx UltraScale+
Physical Comparison
- Packaging Comparison
- SoC Die Comparison
- Mobileye Q5H vs. Q5M
Manufacturing Process Flow
- HiSilicon Ascend 610
- NVIDIA ORIN
- Mobileye Eye Q5H
- Mobileye Eye Q5M
- Tesla FSD Chip
- Renesas R-Car V3H
- Xilinx UltraScale+
- Supply Chain Comparison
Cost Analysis
- HiSilicon Ascend 610
- NVIDIA ORIN
- Mobileye Eye Q5H
- Mobileye Eye Q5M
- Tesla FSD Chip
- Renesas R-Car V3H
- Xilinx UltraScale+
- Cost Comparison
Cost Comparison
Customer Feedbacks
Relative Reports
About Yole Group
Aptiv, Arcfox, Audi, BMW, Flextronics, GAC Motor, Geely, Hiphi, HiSilicon, Huawei, Hyundai, Jaguar, LG, Livox, Li Auto, Mercedes-Benz, Mobileye, Nata, NIO, NVIDIA, NXP, Quadric, Qualcomm, Renesas, Samsung, STMicroelectronics, Intel, TESLA, TOSHIBA, TSMC, Valeo, Veoneer, Volvo, XILINX, XPeng, Zeeker, Zhiji Auto and more
Key Features
- Company profile
- Automotive SoC market analysis
- Detailed photos
- Precise measurements
- Front-end structural analysis with SEM
- Physical comparison
- Manufacturing process flow
- Supply chain evaluation
- Supply chain comparison
- Manufacturing cost analysis
- Manufacturing cost comparison
What's new
- Top-down analysis of car models including ECU teardowns and chip analysis to understand the automotive ADAS SoC market and supply chain
- Detailed physical and cost analysis of seven popular SoCs
- Physical and cost comparison shows how advanced manufacturing is penetrating the automotive industry
High-performance Systems-on-Chips (SoCs) are becoming important in the automotive industry. They support processing and computing in several vehicle segments, including centralized computing, in-cabin sensing, infotainment and cloud computing. One remarkable application is in imaging within Advanced Driver Assistance Systems (ADAS). The processor guarantees high speed operations for data streams from camera, radar, lidar and the central system in cars. This reinforces the ADAS and improves driving safety and assistance performance.
In this report, we focus on ADAS SoCs that handle vision-related data streams. We analyze seven SoCs for central systems, multiple and individual cameras. Some aim to enable autonomous driving and achieve up to 200 teraoperations per second. These SoCs are developed by manufacturers HiSilicon in China, Mobileye in Israel, Renesas in Japan, and the NVIDIA, Tesla and Xilinx in the US. To have a clear view of the supply chain and relevant ADAS market, this report provides a top-down analysis from the car model through to the electronic control unit (ECU) and the SoC. The SoC dies demonstrated in this report are fabricated using TSMC and Samsung’s FinFET technology. By analyzing SoC dies further, we will see how advanced foundries are penetrating the automotive industry.
In terms of physical analysis, this report contains partial teardowns for Mobileye’s EyeQ5M and Tesla’s FSD chip, Renesas’ R-car V3H and Xilinx’s UltraScale+ SoC. To reveal all the details of seven SoCs from package assembly down to die level, we show high resolution photos using optical microscopy and provide detailed measurements. Moreover, we include a complete construction study and multiple analyses of each SoC using Scanning Electron Microscopy (SEM) cross-sections and delayering. In addition, this report contains a complete cost analysis and price estimation of each SoC. Last but not least, we compare packaging, die, and component costs among all the SoCs.
