Automotive CIS Comparison 2023 - DMS & OMS

Overview / Methodology

• Executive Summary
• Reverse Costing Methodology
• Glossary

Companies, Market & Supply Chain

• Onsemi, OmniVision, Infineon
• Players & Market Context
• Automotive Track Data
• Supply Chain

Physical Comparison

• Overview
• Key Results
• Exhaustive Results
• Package
  • BGA
  • a-CSP
• Optical Filters
• Color Filters & Microlenses
• Pixel Transistors
• Stacking

Manufacturing Processes

• CMOS Image Sensor Structure
• onsemi CMOS Image Sensor Manufacturing Processes
  • Supply Chain and Process Overviews
  • Fabs
  • Front-End
• Melexis CMOS Image Sensor Manufacturing Processes
  • Supply Chain and Process Overviews
  • Fabs
  • Front-End
• Infineon CMOS Image Sensor Manufacturing Processes
  • Supply Chain and Process Overviews
  • Fabs
  • Front-End
• OmniVision CMOS Image Sensor Manufacturing Processes
  • Supply Chain and Process Overviews
  • Fabs
  • Front-End

Cost Comparison & Breakdown

• Overview
• Sensor Die Front-End Costs
• Advanced Chip Scale Package Costs
• Die Costs
• Singulated Package Costs
• Component Costs & Prices

Detailed Physical Analysis 

• onsemi AR0135AT
  • Package
  • Sensor Die
• Melexis MLX75027
  • Package
  • Sensor Die
• Infineon IRS1125A
  • Package
  • Sensor Die
• OmniVision OX05B
  • Package
  • Sensor Die

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Related Products 

About Yole Group 

Comparison of Automotive DMS/OMS Image Sensors

Automotive CMOS image sensors (CIS) represent a $2.2B market, and we expect this value to grow to $3.7B by 2029.  This growth is fueled in large part by increasing penetration of advanced driver assistance systems (ADAS), which include in-cabin applications such as driver monitoring systems (DMS) and occupant monitoring systems (OMS).  While in-cabin solutions are often considered as a single market segment, applications are incredibly varied, from driver fatigue and occupant monitoring to augmented reality and gesture recognition.  Accordingly, the segment is powered by a great variety of CIS technologies.

This comprative report synthesizes the results of detailed physical, technical, supply chain and costing analyses of a selection of 4 CIS used in OMS and DMS modules from around the world.  Care was taken to represent a variety of applications, manufacturers, geographical markets, technologies and specs.  The 4 CIS are onsemi’s AR0135AT (3.75 µm global shutter pixel), Infineon’s IRS1125A (second-generation REAL3 time-of-flight pixel), Melexis’s MLX75027 (DepthSense time-of-flight pixel), and OmniVision’s OX05B (2.2 µm global shutter pixel).

These CIS have a variety of resolutions from 0.1 to as high as 5 Mp and use a variety of packages such as advanced chip-scale and ceramic ball grid array.  They contain also a multitide of technologies including global shutter readout, time-of-flight-based depth imaging, in-pixel bonding and infrared enhancement.  They were taken from systems designed for different in-cabin applications including driver attention monitoring, facial recognition, gesture recognition, and occupant monitoring.  They are used by in vehicles and tier 1 system manufacturers from a wide range of geographical areas including Europe, North America and Asia.

We provide a complete manufacturing and costing analysis and comparison for all 4 CIS.  For detailed teardowns of the tier 1 systems using these CIS, be sure the check out our ADAS Tracks product.

Aptiv PLC, BMW AG, Infineon Technologies, Leopard Imaging Inc, LFoundry (Wuxi Xichanweixin Semiconductor), Li Auto Inc., Melexis, Mitsubishi Electric, OmniVision Technologies, ON Semiconductor Corporation, pmdtechnologies AG, Sony Corporation, Subaru Corporation, Taiwan Semiconductor Manufacturing Company, X-FAB Silicon Foundries, Xintec (xintec.com.tw)

Key Feautres

• Detailed photos
• Precise measurements
• Die analysis
• Package analysis
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Physical Comparisons
• Technical Comparisons
• Cost Comparisons

What's news?

• 4 automotive CIS found in OMS and DMS systems.  CIS are selected to represent a variety of CIS, tier 1 and vehicle manufacturers.

Product Objectives

• This comparative report synthesizes the results of detailed physical, technical, supply chain and costing analyses of a selection of 4 CIS used in OMS and DMS modules from around the world.  Care was taken to represent a variety of applications, manufacturers, geographical markets, technologies and specs.  The 4 CIS are onsemi’s AR0135AT (3.75 µm global shutter pixel), Infineon’s IRS1125A (second-generation REAL3 time-of-flight pixel), Melexis’s MLX75027 (DepthSense time-of-flight pixel), and OmniVision’s OX05B (2.2 µm global shutter pixel). We provide a complete manufacturing and costing analysis and comparison for all 4 CIS.