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WHAT’S IN THE BOX? All-in-one front cameras from Continental and HL Klemove at a glance

Both Continental and HL Klemove cameras feature an all-in-one design with an embedded backside illuminated sensor (BSI) and processing function, but differ in components and target market.

Twice a month, Yole Group analysts share the noteworthy points from their automotive Teardown Tracks. Today, Arnaud Morillon and Guillaume Robichon, both Technology & Cost Analysts, take us to the heart of two front cameras, one manufactured in China by the well-established company Continental, for the Changan Shenlan SL03 (2022), the other provided by the newcomer HL Klemove, for the Kia EV6 (2021).

As the automotive industry gravitates towards higher levels of autonomy, OEMs are incorporating more ADAS features. The impact on the revenue of ADAS front camera modules is sure to be felt in the upcoming years, announces Yole Group, in its latest analyses. Therefore, analysts highlight a projected growth from $2.21 billion in 2022 to $3.28 billion in 2028 (source: Imaging for Automotive 2023, Yole Intelligence). Increased revenues will be driven by the growing demand for high resolution cameras with high dynamic range (HDR) and LED flicker mitigation (LFM) features.

Highlights from Yole SystemPlus Teardown Tracks

Both systems share the same all-in-one architecture comprising a rolling shutter CIS (CMOS image sensor), lens module and processor. Despite their commonality in employing BSI technology enabling smaller (4.2 µm) and more sensitive pixels, their targeted car market differs – high-end for the Continental device, and mid-end for the HL Klemove. This has influenced each manufacturer’s component choices.

  • Continental and HL Klemove have respectively called upon OMNIVISION and onsemi, the top players in automotive CIS (Related Yole Group’s press release). While onsemi’s CIS offers a standard 1.7 Mp resolution, OMNIVISION’s chip boasts a resolution four times higher, requiring OMNIVISION to adopt the more sophisticated ‘stacked’ form of BSI technology, PureCel®Plus-S.

  • Continental’s camera module integrates the Horizon Journey 3 processor using TSMC’s 16 nm FinFET, while HL Klemove has selected the Mobileye EYEQ4M based on STMicroelectronics’ 28 nm technology node.

Due to the use of stacked BSI technology, the cost of the OMNIVISION CIS is 40% higher than that of onsemi’s.

In addition, Yole Group indicates that the Continental camera embeds a lens module that is 10% more expensive than the HL Klemove.

Stay tuned for our next What’s in the box? review!

Yole SystemPlus Automotive Teardown Tracks are the result of detailed physical and costing analyses. They are carried out by experts with academic and industrial backgrounds in the semiconductor domain. Yole SystemPlus Automotive Teardown Tracks offer a clear and fruitful understanding of the technical choices made by the leading manufacturers. It also reveals accurate insights related to manufacturing costs.

The company covers the overall supply chain from the components to the system. Based on daily technical and industrial monitoring, Yole SystemPlus has significant expertise to support innovation.


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About the authors

Arnaud Morillon is a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.

With solid expertise in the analysis of electronics boards, Arnaud produces reverse engineering & costing analyses while also working on custom projects for the electronic systems teams. His mission is to identify and analyze the components during the disassembly of the device and cutting of the electronic boards and so determine the final manufacturing cost.

Prior to Yole SystemPlus, Arnaud worked in an ECU low-layer validation laboratory in Velizy-Villacoublay.

Arnaud holds a license in Embedded Systems in Transport and Automobiles from Rennes 1 University (France).



Guillaume Robichon serves as a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.

With solid expertise in the analysis of component quotes, component price estimates, and system encryption, Guillaume produces the engineering & costing analyses while also working on custom projects for the electronic systems teams.

His mission is to identify and analyze the device’s components during the disassembly and cutting of electronic boards and determine the final manufacturing cost.

Guillaume holds a University Diploma in Technology in Electrical Engineering and Industrial IT (Université de Nantes, France).



This article has been developed in collaboration with Anas CHALAK, Technology and Market Analyst, and Peter Bonanno, Technology & Cost Analyst, Imaging at Yole Group.




Source: www.yolegroup.com

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