Consumer MEMS Pressure Sensors Comparison 2023

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Design Win for smartphones and wearables

What's new

• Design wins for smartphones and wearables.
• Pressure sensor evolution in iPhones.
• BOSCH BMP581 – the first capacitive pressure sensor from BOSCH.
• Package integration of the ASIC die in Bosch’s pressure sensors.
• Infineon and Goertek component – the integration of the MEMS microphone and MEMS pressure sensor in the same package.
• TDK-InvenSense’s latest pressure sensor ICP-20100 > moved from monolithical process to the integration of the separated MEMS and ASIC dies.
• Alps Alpine – first time analyzed by Yole SystemPlus.

• BOSCH
• Infineon Technologies
• STMicroelectronics
• TDK-Invensense
• Alps Alpine
• TSMC

During the past few years, the consumer market for MEMS pressure sensors has become significant, mainly due to these sensors’ use in smartphones, wearables, drones, and e-cigarettes.

To encapsulate the increasing interest in the consumer pressure sensor market, Yole SystemPlus provides a deep comparative review of the technology, supply chain, and cost of 12 MEMS pressure sensors. The reference products come from the main suppliers in the market: Bosch, Infineon, TDK-Invensense, STMicroelectronics, and Alps Alpine. Yole SystemPlus has analyzed these pressure sensors to provide insights into their structure, technology, manufacturing processes, and production cost. We studied the packaging, application-specific integrated circuit (ASIC) dies, and MEMS dies, furnishing detailed optical and scanning electron microscope (SEM) pictures of the MEMS structures, package, and cross-section. We’ve also identified the MEMS manufacturing processes.

We note and compare the technological evolutions for each manufacturer, including the differences between the main competitors. The MEMS pressure sensors are compared in terms of structures and technologies, package type, dimensions, and cross-section. For the MEMS dies, the differences in die size and sensing technologies are made. For the ASIC dies, we compare size and technology node. Finally, we make the comparison of the MEMS pressure sensors’ cost in detail for the MEMS components, the ASICs, and the packaging costs.

This report includes the survey data and supply chain evaluation from our consumer teardown of smartphones and smartwatches supplied by Apple, Samsung, Google, Sony, LG, Garmin, and Fitbit. The most recent electronic components were selected for our analysis, and compared to the previous generations.

This report also shows the technology change from piezoresistive to capacitive by BOSCH in its pressure sensor devices, and includes the evolution of the ASIC integration inside the package for the BOSCH sensors found in the latest Apple iPhones and watches.   Moreover, this study includes an analysis of the latest pressure sensor supplied by TDK-InvenSense, in which the monolithic integration of the MEMS and the ASIC dies were changed for the two separated chips in order to enable extended battery life for always-on applications.

Lastly, this report provides an overview of the MEMS microphone and MEMS pressure sensor packaged in the same module and supplied by Goertek – a new solution which helps OEM integrators to save the place and reduce the cost of manufacturing.

Overview 

• Executive Summary
• List of the analyzed components
• Reverse Costing Methodology
• Glossary

Company Profile & Design Win 

• Financial statements of the companies
  • BOSCH
  • Infineon
  • TDK-InvenSense
  • STMicroelectronics
  • Alps Alpine
• Supply chain estimation per Manufacturer
  • ASIC
  • MEMS
    • Front-End Manufacturing Unit
    • Back-End Manufacturing Unit
  • Assembler
• Design Win: Smartphones
  • Apple, Samsung, GOOGLE, SONY, LG Electronics and others
• Design Win: Wearables
  • Apple, Samsung, GARMIN and others

Physical Analysis 

• Summary of the physical analysis
• Technology Overview
  • Type of MEMS Pressure sensors measurement
  • Sensing technology overview
  • Package Overview
    • Package Integration Comparison
    • Waterproof MEMS Pressure sensors Overview
• BOSCH
  • Pressure sensor in iPhone 14 Pro Max and Watch Series 8
  • BMP390, BMP581
  • BOSCH Evolution in APPLE electronics
    • Package, MEMS and ASIC dies comparison
    • Package Integration Comparison
  • Performance Characteristics Comparison per device
• Infineon Technologies
  • DPS368
  • Infineon/Gortek MEMS Pressure sensor and MEMS Microphone device integration Overview
• TDK-InvenSense
  • ICP-10101, ICP-10111, ICP-10125, ICP-20100
  • Package Integration Comparison
• STMicroelectronics
  • LPS22DFTR, LPS27HHWTR, LPS28DFWTR
  • MEMS Pressure Sensor Technology Evolution
• Alps Alpine
  • HSPPAR003D, HSPPAD143A
    • Consumer teardown information: Smartphones & Wearables
    • Datasheet information Overview
    • Summary of the analyzed data: Package, MEMS and ASIC dies
    • Package Opening & Cross Section
    • MEMS Die Cross-Section
    • Process summary
    • Technology Evolution per Manufacturer

Physical Analysis: Opening of the samples                                       

• ROHM Semiconductor
• HOPERF
• TE Connectivity
  • Consumer Teardown information
  • Package Opening, MEMS and ASIC die Overview

Physical Comparison  

• Sensing Technology Comparison
• ASIC and MEMS integration in the package
• Raw wafers used for the manufacturing process
• Package Footprint Comparison
• MEMS die area Comparison

Manufacturing Process Flow Analysis

• Pressure Sensor Wafer Fabrication unit
• Visual description of the process flow

Cost Comparison  

• Yields explanation
• Yields Hypotheses
• Cost of the Component Comparison per player & explanations

Conclusions

• Summary of the Actual Trends
• Future Trends

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