Technology, Process and Cost Comparison

Consumer MEMS Pressure Sensors Comparison 2023

By Yole SystemPlus

Detailed technology and cost comparison of 12 MEMS capacitive and piezoresistive pressure sensors from: BOSCH, Infineon, TDK-Invensense, STMicroelectronics and Alps Alpine


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Design Win for smartphones and wearables

What's new

  • Design wins for smartphones and wearables.
  • Pressure sensor evolution in iPhones.
  • BOSCH BMP581 – the first capacitive pressure sensor from BOSCH.
  • Package integration of the ASIC die in Bosch’s pressure sensors.
  • Infineon and Goertek component – the integration of the MEMS microphone and MEMS pressure sensor in the same package.
  • TDK-InvenSense’s latest pressure sensor ICP-20100 > moved from monolithical process to the integration of the separated MEMS and ASIC dies.
  • Alps Alpine – first time analyzed by Yole SystemPlus.

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