Technology, Process and Cost

DBI Process in Jasminer X4-Q Mining ASIC

By Yole SystemPlus

China’s 3D Integrated Circuit using hybrid bonding interconnection technology between DRAM and logic die


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

Product Objectives

  • Physical and cost analysis of the hybrid bonded logic and DRAM die making the Jasminer ASIC 

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