Technology, Process and Cost

Infineon HybridPACK Drive G2 1200V SiC Module in OBC-DC/DC Converter of XPeng G6

By Yole SystemPlus

This report is scheduled for 2024

SPR24853

  • Detailed photos 
  • Precise measurements 
  • Materials analysis 
  • SoC die floorplan 
  • Manufacturing process flow 
  • Supply chain evaluation 
  • Manufacturing cost analysis 

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