Technology, Process and Cost

Qualcomm Snapdragon 8 Gen 2 SoC

By Yole SystemPlus

A full physical and cost analysis of Qualcomm’s flagship smartphone processor. Comparison with its predecessor reveals Qualcomm’s newest design


Key Features

  • Xiaomi 13 smartphone teardown
  • Detailed photos
  • Precise measurements
  • Front-end structural analysis with Scanning Electron Microscopy
  • Transmission Electron Microscopy analysis and TSMC 5/4 nm FinFET comparison
  • Floorplan
  • Comparison of packaging, die, and floorplan between Snapdragon 8 Gen 2 and 8 Gen 1
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's new

  • The newest generation of Qualcomm’s high-end smartphone processor
  • A new big-LITTLE CPU architecture including the newest Arm Cortex-X3, Cortex-A715, A710 and A510 cores
  • The SoC is manufactured with TSMC’s most advanced second-generation 4nm FinFET technology
  • Simplified SoC die package for cost efficiency 


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