Technology, Process and Cost Comparison
Smartphones Camera Module Comparison 2024 - Xiaomi
Xiaomi’s
latest
flagship introduced
Sony’s
newest
product
for the rear.
Side
modules use the old
CIS with
much
improved
optics
to enhance
picture
quality.
SPR24826
Report objectives:
Continuing our series of camera module (CM) and CMOS image sensor (CIS) comparison reports, we summarize the results of detailed physical and costing analyses to offer insight into the evolution of the Xiaomi’s smartphone photography and selfie cameras. We present a synthesis of physical analysis for the last 4 years of ultra-premium Xiaomi cameras and detailed physical and costing analysis of the cameras in the Xiaomi 12 – 14 Ultra.
Key features:
Detailed photos
Precise measurements
Die analysis
Package analysis
Materials analysis
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Physical Comparisons
Technical Comparisons
Cost Comparisons
What's new in this edition?
Xiaomi 14 Ultra - Main module made more compact by using a 22nm technology node from the new Sony family ( Lytia ).
After benefiting from the disruption caused by the Huawei ban in 2019, Xiaomi has solidified its position as the 3rd biggest smartphone player, representing almost 13% of global smartphone sales in 2023. Their cameras have consistently ranked among the other market leaders and often at lower price points.
In this report we present the results of our detailed physical analysis and costing studies of the Mi 11 Ultra, 12S Ultra, 13 Ultra and 14 Ultra front and rear cameras to offer insights into the physical and cost evolution of the camera modules and CMOS image sensors (CIS) used over the last four years of Xiaomi’s ultra-premium flagships.
Though they have a reputation as a budget smartphone vendor, Xiaomi’s ultra-premium flagship camera spending is outsized, with the majority of the expense coming from large main CIS and complex 7P and 8P lens modules. The main module has grown with each generation with the 13 Ultra retaining the enormous 1” IMX989 and adding a voice coil motor (VCM)-controlled variable aperture, as previously seen in SEMCO modules in the Samsung Galaxy S9 and S10 series. The 14 Ultra maintains the same base as the 13 Ultra while switching from the IMX989 to the newer LYT900 CIS, still from Sony.
The Mi 11 Ultra was based on a triple rear camera that had invested cost-savings into the ultra-wide module, more than doubling its resolution. The 12S Ultra kept the same idea while switching from the Samsung GN2 to the Sony IMX 989 as their main, probably for better light-sensitivity. The 13 Ultra then returned to the quad camera setup, keeping the IMX989 as their main, and using the three supporting modules to debut Sony’s IMX858 with all-pixel on-chip lens-based focusing. This is the first CIS with Sony’s ultra-low power “multi-camera sync system.” While it’s a slightly smaller CIS, Xiaomi decided to increase the aperture size on the supporting module optics to boost the low-light performance and shutter speed. This with the addition of the 3X zoom telescope module for better information from intermediate focal planes makes for one of the most expensive smartphone cameras of the year. And for the 14 Ultra, we discover that apart from the updated main CIS, the architecture remains the same, keeping the IMX858 in supporting modules. The main change comes from the periscope architecture to enhance aperture, with a bigger average lens diameter and overall a module dimension growing 29% from the 13 Ultra. A similar observation can be made on the telephoto module.
In this report we provide a complete manufacturing and costing analysis and comparison for all four cameras, along with a detailed physical analysis for the cameras in the 13 Ultra and 14 Ultra. For the other two smartphones, we present a more cursory physical analysis that is sufficient for comparison. More details would be available in previous reports.
·
Overview / Methodology
o
Executive Summary
o
Reverse Costing Methodology
o
Glossary
·
Companies & Supply Chain
o
Xiaomi
o
Sony
o
Samsung
o
OmniVision
o
SEMCO
o
SUNNY
o
Players & Market Context
o
Supply Chain
·
Physical Comparison & Evolution
o
Camera Overviews
o
Physical Comparison
o
Overview of the Physical Analysis
§
14 Ultra
§
13 Ultra
§
12S Ultra
§
Mi 11 Ultra
·
Manufacturing Processes
o
Camera Module Structure
§
Conventional Module
§
Periscope Module
§
IR-Cut Filter
o
CMOS Image Sensor Structure
o
Sony CMOS Image Sensor Manufacturing Processes
§
Fabs
§
Pixel & Logic Circuits
§
Cu-Cu Hybrid Bonding
§
Optical Layers
o
Samsung CMOS Image Sensor Manufacturing
Processes
§
Fabs
§
Pixel & Logic Circuits
§
TSV Bonding
§
Optical Layers
o
OmniVision CMOS Image Sensor Manufacturing
Processes
§
Fabs
§
Pixel & Logic Circuits
§
Cu-Cu Hybrid & TSV Bonding
§
Optical Layers
·
Cost Comparison & Breakdown
o
CMOS Image Sensor Costs
§
Front CIS Front-End Costs
§
Front CIS Die Costs
§
Rear CIS Front-End Costs
§
Rear CIS Die Costs
§
Rear CIS Die Comparison
o
Camera Module Costs
§
Front Camera Module Costs
§
Rear Camera Module Costs
§
Rear Camera Modules Cost Breakdown &
Comparison
o
Camera Costs & Prices
·
Detailed Physical Analysis
o
14 Ultra Front Camera
o
13 Ultra Front Camera
o
12S Ultra Rear Camera
o
14 Ultra Rear Camera
o
13 Ultra Rear Camera
o
12S Ultra Rear Camera
·
Feedback
·
Related Products
·
About Yole Group
AAC Optics
AKM (Asahi Kasei Microdevices)
Huawei (mentioned only in marketing body)
Jahwa (Korea)
O-Film
OmniVision Technologies
Puya Semiconductor
Q Tech
Samsung Electronics
Samsung Electro-Mechanics
SUNNY Optical Technology
Sony
STMicroelectronics
Taiwan Semiconductor Manufacturing Company
TDK (Japan)
Xiaomi Corporationa