Technology, Process and Cost Comparison
Smartphones Camera Module Comparison 2024 - Xiaomi
By Yole SystemPlus —
This report is scheduled for Q2 2024
SPR24826
THIS TABLE OF CONTENTS IS FROM THE PREVIOUS EDITION - IT MIGHT BE UPDATED.
Overview / Methodology
- Executive Summary
- Reverse Costing Methodology
- Glossary
Companies & Supply Chain
- Xiaomi
- Sony
- Samsung
- OmniVision
- SEMCO
- SUNNY
- Players & Market Context
- Supply Chain
Physical Comparison & Evolution
- Camera Overviews
- Physical Comparison
- Overview of the Physical Analysis
- 13 Ultra
- 12S Ultra
- Mi 11 Ultra
- Mi 10 Ultra
Manufacturing Processes
- Camera Module Structure
- Conventional Module
- Periscope Module
- IR-Cut Filter
- CMOS Image Sensor Structure
- Sony CMOS Image Sensor Manufacturing Processes
- Fabs
- Pixel & Logic Circuits
- Cu-Cu Hybrid Bonding
- Optical Layers
- Samsung CMOS Image Sensor Manufacturing Processes
- Fabs
- Pixel & Logic Circuits
- TSV Bonding
- Optical Layers
- OmniVision CMOS Image Sensor Manufacturing Processes
- Fabs
- Pixel & Logic Circuits
- Cu-Cu Hybrid & TSV Bonding
- Optical Layers
Cost Comparison & Breakdown
- CMOS Image Sensor Costs
- Front CIS Front-End Costs
- Front CIS Die Costs
- Rear CIS Front-End Costs
- Rear CIS Die Costs
- Rear CIS Die Comparison
- Camera Module Costs
- Front Camera Module Costs
- Rear Camera Module Costs
- Rear Camera Modules Cost Breakdown & Comparison
- Camera Costs & Prices
Detailed Physical Analysis
- 13 Ultra Front Camera
- 12S Ultra Front Camera
- 13 Ultra Rear Camera
- 12S Ultra Rear Camera
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