Technology, Process and Cost

YMTC 232-layer 3D NAND Memory

By Yole SystemPlus

YMTC Xtacking 3.0 memory, built using hybrid bonding technology 


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Physical analysis comparison between YMTC’s 232-layer, 128-layer and 64-layer NAND Memory

What's new

  • New generation memory with a total of 232 active wordlines
  • Denser pads and reduced pad pitch
  • Reduced wordline layer thickness
  • Reduced insulating oxide layer thickness

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