Technology, Process and Cost

YMTC 3D NAND 128 layers

By Yole SystemPlus

128-layer 3D NAND using Xtacking 2.0 architecture designed to increase die density and data processing speed.

Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis


Available on our Yole Group All-Inclusive Semiconductor Packaging Package

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