System Plus Consulting has started the reverse costing analysis of this advanced system-in-package component.
In fact, STMicroelectronics decided to develop GaN-on-Silicon enhancement mode HEMT and integrate them with its proprietary driver in a half bridge configuration. The two 650V GaN HEMTs have an area of 3.2 mm2 while the 5.3mm2 driver support UVLO protection. The e-mode HEMT is well suited for the half bridge configuration and the QFN packaging with integrated driver is an advantage for the easy integration in consumer and industrial systems.
Stay tuned for the detailed analysis to be released soon !
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