Industry Insights
Imaging
Beyond the camera bump – An interview with MetaOptics
Global Semiconductor Trends
$2.4 trillion by 2031: welcome to the new semiconductor math
Radio Frequency
Apple and Broadcom extend commitment to 2031: the deal behind the deal
Display
xMEMS Launches the World’s Smallest Active Micro Fan to Break the Thermal Wall in Smart Glasses
Memory
What a year for memory!
Semiconductor Packaging
Inspection and metrology catching up for high-density fan-out panel packaging
Sensing and Actuating
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
MEMS-based optical switches: a strategic technology for AI data centers
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Photonics and Lighting
Grant notification presented: X-FAB develops Erfurt site into a center for microsystems technology
Imaging
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance
Compound Semiconductor
Phlux Technology Announces Beta Sample Availability of Apex 200 µm Noiseless InGaAs® APD Receiver Modules for Ultra Low-Light Detection
Compound Semiconductor
Infineon Found to Infringe Innoscience Patents, Barred from Selling in China
Semiconductor Equipment
ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration
Semiconductor Materials
SCHMID Group announces Agreement for New China Manufacturing Campus to Support Future Growth
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Semiconductor Equipment
Teradyne and TEL Collaborate on Advanced Packaging Test Solution for AI Devices
Global Semiconductor Trends