Tradeshows & Conferences
PIC INTERNATIONAL 2023Sign in for replay
CONNECTING, INFORMING and inspiring the integrated photonics industry
Yole Group is exhibitor!
Once again in 2023, we will be part of the exhibitor and glad to get the opportunity to meet our customers and business partners, establish new contacts in the industry and help drive your business forward.
Interested in an onsite meeting with us? Send us your request at email@example.com
In its 8th year, the flagship event for the global photonic integrated circuits industry returns to Brussels in April – bringing together key players across the supply chain, for two-days of technical tracks and exhibit opportunities.
The PIC International conference attracts high-profile names from industry and academia, delivering presentations that fall within six key themes: Hybrid PICs, Scaling PICs in volume using foundries, Chip-scale packaging, Optimising PICs for optical wireless opportunities, Driving deployment in established markets and PIC Vision: Revolution and evolution.
Yole Group will be part of the event with:
Market Research Director, Fellow
Yole Intelligence part of Yole Group
Wednesday, April 19
Session: Driving deployment in established markets
3:45pm : Market and technologies trends for PICs
Future optical modules must be smaller to decrease power consumption and increase data throughput. As such, progress in integration of optical component technologies has dramatically cut complexity and cost of the modules. Networking hardware is seeing more common components as technology advancements enable tighter integration of communication and computing technologies in commercial systems. As a result, new very-short-reach optical interconnects have emerged for High Power Computing (HPC) and its new disaggregated architecture. Disaggregated design distinguishes the compute, memory, and storage components found on a server card and pools them separately. Photonic Integrated circuit (PIC) is a key enabling architecture for further development of optical interconnect solutions needed to address growing internet traffic. Today Silicon Photonics (SiPho) PIC plays an important role in 500 m and 80 km pluggable interconnects and is a key driving platform for co-packaged optics assembly for networking and HPC. InP PIC is an emerging technology platform targeting coherent links for long-haul applications. With highly integrated optics and silicon chips, new engineering capabilities and foundries will be greatly desired. This presentation will show global trends, future technologies and market forecast for the PIC industry.
WE ARE PARTNERS!
Eric Mounier, PhD
Chief Analyst, Photonics & Sensing
Eric Mounier, PhD is Chief Analyst, Photonics & Sensing at Yole Group.
With more than 30 years’ experience within the semiconductor industry, Eric provides daily in-depth insights into emerging semiconductor technologies such as quantum technologies, the Metaverse, terahertz, photonics, and sensing.
Based on relevant methodological expertise and a significant technological background, Eric works closely with all of Yole Group’s teams to highlight disruptive technologies and analyze business opportunities through technology & market reports and custom consulting projects.
Eric has spoken at numerous international conferences, presenting Yole Group’s vision of emerging semiconductor technologies, markets, and applications.
Previously, Eric held R&D and Marketing positions at CEA-Leti (France).
Eric Mounier has a PhD in Semiconductor Engineering and a degree in Optoelectronics from the National Polytechnic Institute of Grenoble (France).
AngelTech delivers a portfolio of insightful, informative, highly valued chip-level conferences.
Bringing together 3 conferences, 700+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.