IEMT 2022 – 39th International Electronics Manufacturing Technology
YOLE GROUP IS PART OF THIS EVENT with:
Itsuyo OSHIBA, your onsite sales contact: do not hesitate to contact her!
Account Manager – Business Development – Japan, Singapore & SE Asia
sales.restofasia@yolegroup.com
Thank you for stopping by!
Yik Yee, PhD, Senior Technology and Market Analyst,
Speaker: Status of Advanced Packaging
October 20, 2022 – 10:30 AM – 10:55 AM
Shalu ARGAWAL, PhD, Senior Technology and Market Analyst at Power and Wireless Division
Speaker: Evolution of Power Module Packaging Technologies
October 20, 2022 – 11:45 AM – 12:10 PM
DO NOT MISS OUR LATEST PRODUCTS RELATED TO THE TOPIC!
Yole Group publishes several products on Market Trends, Technology, Process & Cost innovations related to the event topics. Let’s find more below…
What products to target and which company strategies to choose in the rapidly evolving power electronics market, which will reach $30.5b in 2027?
Power electronics demand and the ev market are changing the supply chain, driven by increasing vehicle efficiency
New players are disrupting the $37.4b advanced packaging market, investing hugely into new promising technologies with risky return-on-investment
EV/HEVS are transforming the power module packaging supply chain with the evolution of substrate, interconnection, and die-attach technologies. lower cost is starting to win over higher performance.
product to discover very soon…
Status of the Advanced Substrate Industry 2022
This new report is coming soon… Stay tuned!
Industry Insights Articles:
Hitachi, StarPower, Vitesco Technologies, STMicroelectronics, DENSO, Wolfspeed: the ultimate automotive power module comparison
Press Release
Discover the technology and cost comparison of seven automotive power modules from: Hitachi, StarPower, Vitesco Technologies, STMicroelectronics, DENSO, and Wolfspeed.
Atomic Layer Deposition gains traction in More-than-Moore device production
Article – Strategy Insight
Manufacturing at Yole Intelligence, part of Yole Group – Atomic Layer Deposition (ALD) is a thin film deposition technique derived from Chemical Vapor Deposition (CVD) in 1965. Since the dawn of ALD adoption in semiconductor device production, ALD has been used in two disparate semiconductor chip industry streams.