IME multi-chip FOWLP Consortium for 5G – A closer look

In early April the Institute of Microelectronics (IME) in Singapore held an Industry forum to discuss “Multi-chip Fan-out Wafer Level Packaging for the Next Gen Mobile 5G Applications” i-Micronews thought it was worth…A Closer Look.

FOWLP with its key attributes of high interconnect density, low cost and thin form factor is entering a new period of expected high growth. Initial market driver Infineon has now given way to multiple fabless wireless IC companies who are looking to the major OSATS and even foundries (i.e TSMC’s INFO) to supply products.

Historical and projected growth in the FO-WLP market
(Source: Fan-Out and Embedded Die: Technologies & Market Trends, Yole Developpement, Feb 2015 – Update: Sep. 2015)

IME sees the future driven by Mobile, 5G , 2.5D System Integration as shown below.

FOWLP growth driven by mobile, 5G, 2.5D system integration
(Source – IME Industry Forum: High Density FOWLP Platform for Next Generation Mobile/2.5D/5G Systems, March 2016)

The IME consortium proposes the use of the following test vehicles to develop the required technologies.

(Source – IME Industry Forum: high density FOWLP platform for next generation mobile/2.5D/5G systems, March 2016)

Highlights of TV-1 include < 1µm embedded fine pitch interconnect for high density routing in applications such as ASIC/GPU + HBM and support of 50 µm micro bump pitch.
TSV-2 includes direct memory die stacking onto AP fan-out wafer to achieve ultra thin PoP and TMV interconnect density for HBM achieved by vertical WB or copper pillar technologies.
TV-3 will deliver antenna in package with thermal solutions of mm wave 5G automotive applications.

Antenna in Package with thermal solution for 5G mm wave automotive platforms
(Source – IME Industry Forum: High Density FOWLP Platform for Next Generation Mobile/2.5D/5G Systems, March 2016)

They will be working with Cadence, Mentor Graphics and Ansys to develop PDK and ADA reference flow.
The proposed scope of work for the consortium is shown below.

Proposed scope of work for IME multichip FOWLP consortium for 5G applications
(Source – IME Industry Forum: High Density FOWLP Platform for Next Generation Mobile/2.5D/5G Systems, March 2016)

For further information about this consortium please contact IME directly.

From Dr. Phil Garrou for Yole Développement

Source: www.yole.fr