indie semiconductor introduces ultrasonic automotive parking-assist solutions

Addresses Growing Demand for Enhanced Safety Features in Vehicles;

Products Fully Qualified to Stringent AEC-Q100 Requirements

indie Semiconductor, an Autotech solutions innovator, which is currently in the process of merging with Thunder Bridge Acquisition II, a special purpose acquisition company, unveiled a family of high-performance sensing solutions supporting automotive parking-assist applications. Leveraging its mixed signal, digital signal processing (DSP) and power management expertise, indie’s highly integrated Echosense™ and Sonosense™ devices incorporate proprietary DSP algorithms that reduce hardware requirements and lower overall costs. The solutions embody the company’s holistic and optimized approach to solving the Autotech industry’s most challenging architectural issues.

With increasing global concerns over enhanced safety, automotive manufacturers are actively including features such as intelligent parking-assist systems into their vehicles,” said Paul Hollingworth, indie’s executive vice president of sales and marketing.  “indie is excited to be enabling differentiated technologies that support advanced driver assistance systems, and ultimately fully autonomous vehicles.  Our Echosense™  and Sonosense™  platforms provide OEMs with comprehensive architectures that simplify their design cycles, offer significant cost advantages and deliver the safety benefits drivers demand.”

In addition to its suite of parking-assist solutions, indie is also developing cutting-edge platforms for computer vision cameras, FMCW LiDAR, radar and sensor fusion applications serving Tier 1 customers and major automotive OEMs.

indie’s products serve four types of automotive applications: safety systems, connected car, user experience and electrification.  According to IHS research, these key functions are projected to grow at a 19 percent compounded annual growth rate, from $16 billion in 2020 to $38 billion by 2025, substantially outpacing the broader global automotive semiconductor market during the same period.