NCAP and Yole Développement invite you to the 2nd edition of the Advanced Packaging & System Integration Symposium
Advanced packaging is becoming a key part of the semiconductor industry’s added value, and not just a way to put a device in a box and interconnect it to a PCB. Multiple new platforms like fan-out, embedded die, and CSWLP are now available for volume manufacturing. Multiple applications (primarily mobile phones but also automotive applications) are driving the adoption of such technologies in parallel with the development of PoP, flip chip, and others.
Chinese companies and the Chinese government are massively investing in all parts of the semiconductor supply chain, including R&D, in order to create a leading semiconductor ecosystem in China. In order to gain an overview of Chinese activities and key technology and industrial trends, Yole Développement (Yole), the NCAP (Chinese National Center for Advanced Packaging, a leading advanced packaging R&D center based in Wixi), and ASTRI have organized a two-day workshop and conference covering packaging industry evolutions. Yole Développement interviewed Dr Cao LiQiang, CEO of NCAP and asked him about the Chinese packaging industry’s evolution, the applications that are pushing new platforms, and his opinion on the industry’s rapid growth.
Yole Développement: As an introduction, can you please explain what NCAP’s mission is?
Cao LiQiang: NCAP’s mission is to establish a globally-active R&D centre for semiconductor packaging areas and gain a leading edge in advanced packaging through IP licensing and commercialization of technology development and transformation, in concert with semiconductor packaging supply chain requirements. This technology development centre will become a common technology development platform in China, complete with technology incubators and a personnel training centre.
YD: As one of China’s key R&D centers, can you explain how NCAP is positioned in the advanced packaging area?
CL: In order to develop national semiconductor core competences in advanced packaging, NCAP is responsible for supporting the development of an IC packaging value-proposition and commercialization chain, pushing world-class technology development, improving R&D development and commercialization, and cultivating a strong team with a broad global view and capabilities.
YD: Who are the others players pushing the industry in China?
CL: The other key players are from Chinese OSATs, substrate manufacturers, and universities, including JCET, NT Fujitsu, Hua Tian Science & Technology, SCC, IME (China), WLCAP, ANJILI, Xing Seng Kua Jie, Wu Xi Wu Lian Wang, NDB (National Developed Bank), Tsing Hua University, Beijing University, and Fu Dan University.
YD: What are the key platforms today? Which ones will be key in the future?
CL: Based on NCAP’s development strategy, today’s key platforms are flip chip, WLCSP, fan-in, and TSV related technologies, providing manufacturing, technology service, and process assessment. In the future, NCAP will provide fan-out, optoelectronics, and power electronics technology development platforms.
YD: What are the challenges that China faces in advanced packaging?
CL: The challenges that the whole advanced packaging industry faces are unbalanced developments of semiconductor equipment and materials in certain areas. Price and cost controls are crucial for company survival, and production output, efficiency, and technology promotion are still critical for industry development.
YD: How is NCAP supporting China’s development in advanced packaging?
CL: NCAP is supporting semiconductor packaging in terms of technology development and transferal, project collaborations, consortium and National Projects, etc.
YD: Which applications are pushing the development of advanced packaging platforms?
CL: Many applications are pushing technology development. For example, in optoelectronics, the market needs 4X10G application, and NCAP is working closely with partners to develop the technology in terms of sample preparation, documentation and IP licensing, etc. At the same time, NCAP is also supporting CIS technology development, WLCSP, and TSV-associated applications.
YD: Why have Yole and NCAP decided to renew their partnership for a second edition of the Advanced Packaging & System Integration Symposium?
CL: Yole is a globally-renowned marketing and technology analysis company. With the advanced packaging industry moving very fast in China, Yole needs a strategic partner to work with and gain further understanding of the market and technology development aspects. NCAP is building up its capability and becoming well-known in China. The joint symposium solidifies our collaboration and brings huge benefits for both companies, as well as many other companies who want to enter China’s markets or prepare to enter China’s markets.
YD: Which key technical challenges will be discussed during the event?
CL: The world is currently experiencing many challenges and variations in many aspects of advanced packaging. IoT, wearable products, MEMS sensors, power electronics, optoelectronics, and others are experiencing many changes with TSV,TSV-less, fan-in and fan-out technologies, etc., which are becoming major technical topics for discussion during the event.
YD: Who should attend this event, and why?
CL: Engineers, managers, and leaders in semiconductor advanced packaging, especially those in OSATs, material and equipment suppliers, PCB and substrate manufacturers, design houses, and foundries, as well as end-users, are welcome to attend this event because it’s a great opportunity to absorb new knowledge and market information regarding what has happened and what will happen in advanced packaging.
YD: What are your expectations for the NCAP symposium?
CL: It will be an exciting event, and I wish much success and a wonderful experience to everyone attending this joint symposium.
Welcome, event-goers, to Wuxi, Jiangsu province!
Source: http://www.ncap-cn.com/en/ and www.yole.fr
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