Rudolph receives multi-system order for over $11 Million from a leading OSAT for Fan-out Wafer Level Packing inspection
Rudolph Technologies, a designer in, development, manufacture and support ofdefect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated solution consisting of multiple process control inspection systems and yield management software suite.
The solutions will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in Q2 2016, with the majority of the order shipping the second half of 2016.
“We are pleased with this order and the confirmation of Rudolph Technologies’ fan-out wafer level packaging (FOWLP) solution portfolio,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group Business Unit. “Key factors of this win were the systems’ unique FOWLP process control capabilities including superior defect capture and identification rate, combination 2D+3D metrology and flexible wafer automation solutions. All systems will be equipped with Rudolph’s Discover® Yield Management Software and TrueADC® Classification software that enhances the user’s process analysis capability, enabling our customers to make targeted data-driven decisions increasing the total productivity of the overall fab.”
“FOWLP is growing rapidly, and to facilitate that growth Rudolph has focused on integrating technologies into solutions for monitoring and characterizing manufacturing lines particularly in the areas of bump processing as well as die singulation quality control,” said Mike Plisinski, chief executive officer of Rudolph. “This continued investment by a leader in FOWLP underscores the importance of our solutions and the compelling value they provide. This investment is further confirmation of the advanced packaging sector’s growth rate as our industry continues the transition towards cost effective, high performance packaging solutions.”
Source: http://www.rudolphtech.com