STATS ChipPAC’s fan-out wafer level packaging shipments exceed 1 Billion units
Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications .
STATS ChipPAC, a provider of advanced semiconductor packaging and test services, announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package.
As the industry was beginning to learn about eWLB in 2008, STATS ChipPAC immediately recognized the significant potential, value and scalability of eWLB and designated it as a key technology for the company. Within a year, STATS ChipPAC had ramped eWLB to high volume production and was driving a number of technology and manufacturing initiatives in this new packaging approach. STATS ChipPAC has led the industry in eWLB manufacturing capabilities, capacity and technology innovations, particularly in 2.5D and 3D package designs. STATS ChipPAC became the first company in the semiconductor industry to implement significantly larger than 300mm eWLB wafer manufacturing capabilities and has a strong portfolio of innovative eWLB packages, including small die, large die, multi-die, multi-layer, Package-on-Package (PoP) and System-in-Package (SiP) architectures.
“We differentiated STATS ChipPAC by our unwavering commitment to eWLB technology over the years, beginning with our vision of how this scalable packaging platform can be leveraged to drive performance and size advantages for our customers’ applications. Over the years we have made significant capital investments and process enhancements to fulfill our vision and raise the bar on manufacturing efficiency and productivity in the industry, adding further value for our customers,” said Dr. Han Byung Joon, President and Chief Executive Officer, STATS ChipPAC. “Although we have achieved multiple milestones with eWLB through the years, shipping over one billion eWLB packages is a testament to the ever expanding customer adoption in the industry and success which we knew was possible with this game changing technology.”
The exceptional success of eWLB in the mobile market, particularly in baseband processors, connectivity devices, Codec devices, RF transceivers and power management integrated circuits (PMICs), is a reflection of the ongoing pressure semiconductor companies face in cost effectively achieving higher input/output (I/O), higher bandwidths and lower power consumption in the smallest possible form factor. STATS ChipPAC has driven a number of eWLB technology achievements such as dense vertical interconnections as high as 500 – 1,000 I/O, very fine line width and spacing down to 2um/2um and ultra thin package profiles below 0.3mm (including solderball) for single packages and below 0.6mm for a stacked PoP with proven warpage control.
With the ability to partition silicon and embed passive devices and vertical interconnects (known as eBar) into a design, eWLB is a powerful integration technology for 2.5D and 3D PoP or SiP solutions for a wide range of new and emerging applications. The compelling performance, size and cost advantages of eWLB are accelerating the adoption of this advanced technology into new markets such as the Internet of Things (IoT) and wearable electronics, Micro-Electro-Mechanical Systems (MEMS) and automotive applications. Examples of new eWLB applications are Advanced Driver Assistance Systems (ADAS) in automobiles and bio-processors in the wearables market.
Source: http://www.statschippac.com
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