Tokyo Electron introduces Ulucus™ L, a Laser Edge Trimming System for 300ｍｍ Wafer-Bonded devices

Tokyo Electron announced the launch of Ulucus™ L, a laser edge trimming system for 300ｍｍ wafer-bonded devices.

Ulucus L is a laser edge trimming system that integrates an advanced laser control unit with LITHIUS Pro™ Z, TEL’s widely recognized coater/developer platform. The system offers super clean technology and excellent reliability/productivity comparable to those available in front-end processes.

The system uses laser control technology to produce high-quality cut surfaces through precise and speedy edge trimming operations. Because the laser process is dry and does not require deionized water (DIW), consumption of DIW can be reduced along with dust emissions and wastewater discharges. Since edge trimming is performed after wafer bonding, fewer process steps are required before and after trimming.

“As semiconductor scaling continues, the advancement in 3D high-density packaging is accelerating to facilitate further evolution of semiconductor performance,“ said Yohei Sato, General Manager of ATS BU at TEL. “Wafer bonding is a critical step in this endeavor, and innovative technologies are eagerly awaited—not only in the wafer bonding process but also in the subsequent edge trimming process. Enabled by laser control technology, Ulucus L provides an innovative eco-solution that reduces the burden on the environment, as well as an contribution to higher productivity. Going forward, TEL will continue to develop and introduce advanced technologies and products that satisfy our customers’ needs.”