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Towards 90% of cars connected in 2028: what are the driving forces?

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The automotive connectivity module market is anticipated to reach more than US$6 billion by 2028.

OUTLINE

  • The connectivity module market for telematics and V2X applications will reach US$6.1 billion in 2028 with a CAGR of 16% between 2023 and 2028.
  • The market is propelled by the growing need for advanced connectivity and safety solutions.
  • In the cost sensitive automotive industry, Redcap and intelligent antenna put 5G-V2X TCUs within reach.
  • Qualcomm is gearing up to become the undisputed leader in automotive connectivity chipsets with the recent acquisition of Autotalks.

The connectivity module market is projected to grow from US$2.9 billion in 2023 to US$6.1 billion in 2028 with a CAGR23-28 of 16%. Nevertheless, according to Yole Intelligence, the landscape is evolving rapidly, with compelling use cases like Teleoperated Autonomous Vehicles and Automated Valet Parking expected to be implemented by the end of the decade. NCAP programs, especially China NCAP and EuroNCAP, are also driving V2X adoption as soon as 2025.

Raphaël Da Silva, Technology and Market Analyst within the Power and Wireless Division at Yole Intelligence
“Telematics adoption is driven by lucrative business opportunities, offering enhanced user experience and valuable data for OEM s. Mandatory connectivity-based safety features like eCall and ISA are expanding globally. The adoption of 5G connectivity is influenced by higher costs and the absence of a definitive killer application, but it aligns with software-defined architecture for advanced autonomous driving.”

Yole Intelligence, part of Yole Group has combined its long expertise in semiconductors and its deep knowledge of automotive connectivity technologies and markets to deliver this first edition of the RF for connected vehicles report. This study provides valuable market metrics and forecasts for automotive connectivity. It analyzes the drivers and challenges for automotive connectivity adoption and presents the main technological trends and ongoing developments in automotive connectivity with a focus on 5G RedCap and GNSS correction services. This report also discusses the main players across the automotive connectivity supply chain and analyzes how the business models and supply chains are evolving.

Titre du visuel

june 2021

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Thematic(s) :

Cédric_MALAQUIN-CMA_YINT
Cédric Malaquin, Team Lead Analyst for RF activity, at Yole Intelligence
“The automotive connectivity landscape has evolved with the introduction of technologies like 5G and C-V2X . In the 4G era, Intel, HiSilicon, and Qualcomm served the market, but Qualcomm took the lead in 5G after HiSilicon and Intel exited the business. Samsung and MediaTek entered the market recently, but qualification cycles in the automotive connectivity industry are long, so Qualcomm’s dominance is expected to continue in the short term.”

Regarding V2X, NXP initially led with its DSRC chipset, but due to regulatory challenges and the introduction of C-V2X, Autotalks and Qualcomm gained prominence. Qualcomm’s advantage lies in its scale and the integration of V2X in the cellular baseband, aligning with non-safety applications. However, for safety-related V2X applications in the future, Autotalks is expected to excel as a standalone V2X is necessary for ASIL-B certification.

In terms of GNSS, Qualcomm’s integration of GNSS capabilities in its cellular baseband impacted U-Blox’s position in the TCU business. However, with safety becoming a requirement for future applications, GNSS players like U-Blox are seeing renewed interest.

Consolidation has occurred among sub-system companies, such as the merger of Telit and Thales’ module business and the equity acquisition of Rolling Wireless by Fibocom. At the Tier 1 level, consolidation has already occurred, with Valeo acquiring Peiker and Samsung purchasing Harman. However, there are still numerous small-scale companies in the supply chain that may be acquired as the market continues to grow.

Yole Intelligence’s RF team invites you to follow the technologies, related devices, applications, and markets on www.yolegroup.com.
Do not miss the European Microwave Week 2023, from September 17 to 22, in Berlin, Germany. Come and meet Yole analysts and look through the latest market, technology, reverse engineering and reverse costing analyses.
Send us your request for an onsite meeting at events@yolegroup.com.

Stay tuned!

Acronyms

  • NCAP : New Car Assessment Programs
  • V2X : Vehicle-to-everything
  • OEM : Original Equipment Manufacturer
  • eCall : Emergency Call
  • ISA : Intelligent Speed Assistance
  • GNSS : Global Navigation Satellite System
  • C-V2X : Cellular-Vehicle-To-Everything
  • TCU : Telematic Control Unit

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