The evolution of TCU architecture is driven by the need for improved performance and adherence to ASIL (Automotive Safety Integrity Level) standards.
Twice a month, Yole SystemPlus analysts share the noteworthy points from their Automotive Teardown Tracks. Today, Baptiste Desbois and Maël Fontaine, Technology & Cost Analysts from Yole SystemPlus, take us to the heart of two 5G TCUs manufactured by Joynext and Jabil.
By 2028, an estimated 90% of vehicles are expected to be equipped with cellular connectivity, with 5G steadily overtaking 4G as cheaper (RedCap) devices emerge. The widespread adoption of TCUs, hailed for enhancing user experience, is additionally driven by regulations mandating the eCall feature. As a result, a CAGR in revenue of 80% for 5G TCUs is forecasted between 2022 and 2028 (1).
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Highlights from Yole SystemPlus Teardown Tracks
The current trend in TCU architecture is toward combining connectivity and V2X communication in a single system, countering the decline of OBUs (on-board units). Advantages of this configuration include minimized RF losses, easier integration, and reduced cost.
Nothing better illustrates this trend than this Yole SystemPlus analysis. While Joynext and Jabil TCUs share the same connectivity level using the Snapdragon X55 5G IC from Qualcomm, they offer distinct functionalities.
The Jabil 5G TCU combines a GPS/BDS module for in-dash navigation with a NAD module provided by Quectel. In this case, for V2X communication in the car, an OBU would still be required.
The Joynext device takes integration a notch higher compared to Jabil’s. Alongside 5G connectivity, the NAD module, also manufactured by Quectel, embeds an RF frontend chip for V2X communication. The main board houses another subassembly provided by Quectel that enables Wi-Fi and Bluetooth functionalities.
With the increasing safety capabilities of V2X, a novel design leap will be necessary to align with ASIL-b standards. Consequently, chips for connectivity and V2X communication will have to be integrated into the TCU in two distinct modules.
Stay tuned for our next What’s in the box? review!
Yole SystemPlus Automotive Teardown Tracks are the result of detailed physical and costing analyses. They are carried out by experts with academic and industrial backgrounds in the semiconductor domain. Yole SystemPlus Automotive Teardown Tracks offer a clear and fruitful understanding of the technical choices made by the leading manufacturers. It also reveals accurate insights related to manufacturing costs.
The company covers the overall supply chain from the components to the system. Based on daily technical and industrial monitoring, Yole SystemPlus has significant expertise to support innovation.
“RF for Connected Vehicle 2023” by Yole Intelligence – https://www.yolegroup.com/product/report/rf-for-connected-vehicle-2023/
About the authors
Morgan Collin serves as a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.
With solid expertise in the analysis of electronics boards, Morgan produces reverse engineering & costing analyses while also working on custom projects for the electronic systems teams.
His mission is to identify and analyze the electronic boards and mechanical components of devices during the disassembly process. The objectives of these analyses are to understand the structure of the device, identify all the components, and determine the final manufacturing cost. In addition, he works on the construction of the block diagrams for the different reports and monitors the display software. Prior to Yole SystemPlus, Morgan worked as a production technician, purchasing and stock management, at Fougerolle.
Morgan holds a BTS Digital Systems degree (Ecole Jeanne d’Arc, France).
Baptiste Desbois serves as Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.
With solid expertise in the analysis and the troubleshooting of electronics boards, Baptiste produces reverse engineering & costing analyses while also working on custom projects for the electronics systems teams. His mission is to identify and analyze the components during the disassembly of the device and cutting of the electronic boards and determine the final manufacturing cost. This will provide the raw information to produce the reverse costing reports.
Prior to Yole SystemPlus, Baptiste worked as a bench test validation technician for Sercel (Nantes, France)
Baptiste holds a BTS Digital Systems Option B: Electronics and Communication and a professional license in mechatronics from E.S.P.R.I.T Campus (Redon, France).
This article has been developed in collaboration with Raphaël DA SILVA, Technology and Market analyst, Power and Wireless Division at Yole Intelligence.