YG PRESS NEWS – From steady GaAs to dynamic InP market: could intense competition result in one dominant technology?
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GaAs and InP photonic technologies markets are being shaped by consumer applications.
- The InP market will grow from US$3 billion in 2022 to US$6.4 billion in 2028.
- The competition of two business models in GaAs photonics directly reshapes the supply chain.
- The GaAs and InP photonics markets are shaped by the consumer applications.
- Sony is now qualifying the potential GaAs substrate suppliers. Several players have been identified, as has the decision date and mass production timeline.
InP’s main market drivers are datacom and telecom due to its ability to achieve high bandwidth, data rates, and long reach in optical transceivers. In the Photonics GaAs and InP Compound Semiconductor Market Monitor, Yole Intelligence, part of Yole Group, predicts that the InP market will grow from US$3 billion in 2022 to US$6.4 billion in 2028. However, there is increasing interest in emission and detection at wavelengths around 1300nm and 1500nm for sensing applications. Major consumer product manufacturers adopting InP for proximity sensors in wearable earbuds and in smartphones have been spotted. For instance, Apple, a leading innovator in the handset business, has reduced the notch size in the iPhone 14 Pro family to a pill shape, positioning some sensors below the OLED screen. Such a move means replacing GaAs VCSELs with InP Edge Emitting Lasers (EELs). This move could lead to major GaAs players entering the InP market since both materials share the same processing tools… For more information about this analysis, please contact us!
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june 2021You have to be registered to download our medias.
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Related event
ECPE 2023 – Yole Group will be part of the ECPE Wide Bandgap User Forum with Poshun CHIU, Technology & Market Senior Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence. He will present SiC Materials and Substrates Trends during the session Application Aspects of Recent SiC Devices on Wednesday, March 29 at Erding, Germany.