Technology, Process and Cost

Apple A17 SoC in iPhone 15 Pro

By Yole SystemPlus

SPR23776

Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's new?

  • The first TSMC 3nm consumer product
  • The newest and most powerful smartphone SoC from Apple

Product Objectives

  • Provide technology data, manufacturing cost and selling price.
  • Teardown on the main board of Apple iPhone 15 Pro Max to see the components around A17 chip
  • Physical analysis of packaging and processor die by CT-scan, EDX, optical microscope, scanning electron scope and transmission electron microscopy .
  • Clear view on the technology and supply chain.
  • SoC package size,  die size, die delayering and floorplan to reveal the manufacturing and IP architecture.
  • SoC manufacturing, its supply chain and cost structures.
  • A comparison of Apple A16 bionic and A17 Pro chip of packaging, die, front-end-of-line and floorplan are presented to understand the evolution of Apple’s self-designed processor.

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