Technology, Process and Cost

Apple A17 SoC in iPhone 15 Pro

By Yole SystemPlus

Full reverse costing study on technology data, manufacturing cost and selling price of the Apple A17 Chip.


Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

What's new?

  • The first TSMC 3nm consumer product
  • The newest and most powerful smartphone SoC from Apple

Product Objectives

  • Provide technology data, manufacturing cost and selling price.
  • Teardown on the main board of Apple iPhone 15 Pro Max to see the components around A17 chip
  • Physical analysis of packaging and processor die by CT-scan, EDX, optical microscope, scanning electron scope and transmission electron microscopy .
  • Clear view on the technology and supply chain.
  • SoC package size,  die size, die delayering and floorplan to reveal the manufacturing and IP architecture.
  • SoC manufacturing, its supply chain and cost structures.
  • A comparison of Apple A16 bionic and A17 Pro chip of packaging, die, front-end-of-line and floorplan are presented to understand the evolution of Apple’s self-designed processor.

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