Technology, Process and Cost
RF Front-End Module Comparison 2021 - Volume 3 – Focus on Samsung
By Yole SystemPlus —
Evolutive technical and cost comparison between the radio frequency front-end module technologies integrated in Samsung’s 2019-2021 smartphone series.
Evolutive technical and cost comparison between the radio frequency front-end module technologies integrated in Samsung’s 2019-2021 smartphone series.
Last year, System Plus Consulting opened up hundreds of front-end modules (FEMs) and components in select flagship smartphones to provide an overview of the radio frequency (RF) FEM market. Gathering this information into four reports, ranging from player’s evolution to a world area analysis, offered an opportunity for tracking the evolution of this technology market.
This year, System Plus Consulting again offers different volumes of technical and cost comparisons for smartphone RFFEMs. Each report focuses on a specific subject: it can be a player’s evolution, a specific technology, or a comparison of flagship devices.
This third volume provides insights into technology and cost data for FEMs and several components found in the Samsung Galaxy S21 series in 2021. Included is a comprehensive overview of the RFFEM architectures on the market, comparing available smartphones from each company – with a focus on Samsung. Component dependency of Samsung to a specific manufacturer is revealed, along with the different choices in integration of communication technology – even millimeter wavelength (mmWave) signal support in Samsung’s latest generation. This volume also reveals how Samsung maintains its leadership on several levels in these markets.
With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed – from the output of the transceiver to the antenna. Packaging, sizes, and technologies were also studied to provide a large panel of technical and economic choices as well as an overview of the market.
Lastly, this report includes a statistical analysis for most of RF front-end modules and explains the smartphone maker’s choices and supplier tendencies. All RFFEM are integrated in this report, from baseband to antenna tuner, on 5G, 4G, Wifi, BT, GPS, and UWB.
Overview / Introduction
Market & Technology Analysis
- RFFE & Connectivity Market Forecast
- Current Technology Landscape
- Smartphone and Supplier OEM Market Share
- Samsung Galaxy Series
- Samsung Galaxy 2020 generation
- Component Summary
- Database Content: RF Area, LTE/5G bands per smartphones, Module in RF area
- Component Summary: Evolution of supplier, Evolution of RF packaging
- Comparative Analysis: Design win in RFFE and Connectivity, Main Supplier, Function
Physical Comparison
- Area Distribution per Supplier & Function
- Die Design Win in Number & Area
- Die Distribution per Function
- Filter Distribution per Smartphone: Technology & Substrate
- PA/LNA/Switch Distribution per Smartphone: Technology & Substrate
- Material Substrate Distribution per Smartphone
Cost Comparison
- Chipset Cost Evolution
- Cost Distribution per Supplier & Function
Physical & Cost Analysis
- Smartphones Teardown S21 Series
- Summary of the Analyzed RF Components
- Summary of Comparative Study
- Baseband Analysis
- Modem analysis : package and die views & dimensions comparison
- RxTx analysis: package and die views & dimensions comparison
- S21 series modem & 5G sub-6 and mmwave RxTx analysis : packages views & dimensions comparison, dies views and dimensions comparison, dies main block ids, dies process characteristics, component cost comparison and cost
- S21 series Front-End Analysis
- Main PAMiD Front-End Analysis: package Views & Dimensions, package Opening, Die Views And Dimensions, Die Summary, RF Component Comparison and Cost
- FEM & Diversity Front-End Analysis
- Filters Front-End Analysis
Complete teardown with:
- Detailed Photos
- Precise Measurements
- Module Opening
- Die Measurements
- Complete Bills-of-Materials for the Modules
- Comparison Between Suppliers
- Comparison Between OEMs
- Cost Comparisons
- Detailed Technical and Cost Analysis of 39 Components