Technology, Process and Cost

RF Front-End Module Comparison 2021 - Volume 4 – Focus on WiFi 6/6E

By Yole SystemPlus — Dec 2021

Technical and cost overview of the latest radio frequency connectivity front-end technologies, with a deep analysis of Wi-Fi 6/6E architecture.

Technical and cost overview of the latest radio frequency connectivity front-end technologies, with a deep analysis of Wi-Fi 6/6E architecture.

Each year, System Plus opens hundreds of front-end modules (FEMs) and components in select flagship smartphones to provide an overview of the radio frequency (RF) FEM market. Gathering the information into one report offers an opportunity to track the evolution of this technology market.

This year, System Plus Consulting proposes different volumes of technical and cost comparisons of smartphones’ RFFEM. Each report focuses on a specific subject: this can be a player’s evolution, a specific technology, or a comparison of flagship devices.

This fourth volume provides insights into technology and cost data for Wi-Fi chipsets – specifically, the SoC, FEMs, and several components found in four of the latest smartphones: the Huawei P50 Pro, iPhone 13 Pro Max, Samsung Galaxy S21 5G, and Xiaomi Mi 11 Ultra. This report features a comprehensive overview of the connectivity architecture on the market, comparing Wi-Fi AC (aka 5.0) to Wi-Fi AX (aka 6/6E). As the architecture is central on the SoC, PAs, switches, and LNAs, a detailed analysis (including a cross-section and technology analysis) is also provided. Furthermore, different choices of architecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei.

With teardowns of these smartphones, the main RF modules and components were extracted and physically analyzed – from the output of the transceiver to the antenna. Packaging, sizes, and technologies were studied to provide a large panel of technical and economical choices, and an overview of the market is provided as well.

This report includes an overview of other flagship smartphones released by the end of 2020/beginning of 2021 and furnishes a statistical analysis for most of the connectivity modules. An explanation of the smartphone makers’ choices and supplier tendencies is also provided. Analysis of front-end modules for LTE and 5G is not included in this report.