Market and Technology Trends

System-in-Package 2023

By Yole Intelligence

SiP powered by Chiplet and Heterogeneous integration: from $21.2B in 2022 to $33.8B in 2028.


Key Features​

  • Overview of the SiP market
  • Market forecast for FC&WB SiP, FO SiP and 2.5/3D SiP
  • Analysis of partnerships for leading edge technologies
  • SiP market share in 2022
  • Analysis of China’s SiP Supply Chain
  • SiP technology trend towards 2.5/3D solutions
  • Chiplet and heterogeneous integration trends
  • SiP assembly process flow

What’s new? 

Added 2.5D/3D SiP forecast and deep insight of technologies trend for different SiP.


Product objectives

Advanced System-in-Package (SiP) 2023 is an updated report that explores in detail the hottest trends in advanced semiconductor packaging.

The report’s objectives are as follows:

  • Provide a market forecast for system-in-package revenue (2022-2028)
  • Focus on flip-chip, wire-bond, fan-out, and 2.5D/3D platform
  • Explanation of growth for end-markets and end-devices
  • Market trends
  • Drivers, by end-market
  • Market share
  • Breakdown, by manufacturer
  • Furnish a full supply-chain analysis of SiP players
  • SiP manufacturers & key customers
  • SiP business models - full analysis
  • Technology trends for SiP technologies
  • Technical roadmaps

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