Market and Technology Trends

Status of the Advanced Packaging Industry 2024

By Yole Intelligence

The growing role of Advanced Packaging Technologies and Supply Chain Strategies to back up HPC and AI


Key features

  • The Advanced Packaging industry attained a market value of $37.8 billion in the year 2023. This market is expected to surpass $69.5 billion by 2029, showcasing a CAGR of 11% during the period from 2023 to 2029.
  • The largest market in 2023 was the 'Mobile & Consumer' sector, which accounted for more than 70% of the total revenue. However, it is expected that this share will decrease to 61% by 2029 as the 'Automotive' and 'Telecom & Infrastructure' sectors gain larger market shares. These two sectors are projected to be the fastest-growing markets by 2029, with respective CAGRs of 18% and 10%.
  • In terms of packaging technologies, the primary contributors to the market are flip-chip, 2.5D/3D, and SiP, which are expected to hold a combined market share of over 90% by 2029. Additionally, the top three platforms experiencing the highest growth rates are ED, 2.5D/3D, and flip-chip.

What's new?

  • New technology platforms added,
  • New OSATs mapping
  • Thermal Management

Product objectives

The “Status of the Advanced Packaging Industry” is a yearly overview report. The objectives of the report are:

  • To provide an overview of the Advanced Packaging market
  • Drivers and dynamics
  • Future applications
  • Disruptions and opportunities
  • To present our analysis of the supply chain
  • Overview of production by player (IDM, OSAT, foundry)
  • Shifting business models
  • Financial analysis of TOP 30 OSATs
  • To discuss technology trends and forecasts
  • Revenue, wafer, and unit forecasts by platform
  • Future development by platform
  • Impact of front-end scaling
  • Scaling and functional roadmaps

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