Market and Technology Trends

Status of the Advanced Packaging Industry 2024

By Yole Intelligence

This report is scheduled for Q3 2024


This Status of Industry Report comprises data on AP platforms such as Flip-Chip (FC), Fan-In (WLCSP), Fan-out, Embedded Die, 2.5D and 3D stacking as well as FC System-in-Package. Overviewed are the 2024-2029 market potential forecast for AP platforms (revenue, package units’ shipments and wafer start units), data on AP platform supply chain, roadmaps, manufacturers (revenue, market share, CapEx), technology and production aspects, and the significant yearly industry news.

Scope of the previous report

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