Goertek released a combination MEMS microphone/pressure sensor based on Infineon Technologies’ die, with multiple controllers embedded in the substrate.
Goertek’s module looks like a typical microphone found in smartphones and wearables from the outside, and even under the metal lid. However, upon closer inspection made by Yole SystemPlus’ team, additional components are observed in the substrate.
Indeed, a typical microphone has the sensor and interface under the module lid whereas the combo sensor has two MEMS devices under the lid: microphone & pressure sensor.
The controllers for the sensors were not visible after removing the metal lid since they were found embedded in the substrate. This combination sensor makes a lot of sense because both microphone and pressure sensor require an external air port. Combining the two sensors into a single module reduces the external ports by one. Additionally, there is an obvious board space savings.
Yole SystemPlus, Consumer Teardown Tracks team, found the Goertek combination sensor in two fitbit products recently: Versa 4 and Sense 2. Both designs still have a separate air port for a pressure sensor and space inside for it too. But the internal space was occupied by just a foam spacer- presumed reserved for a typical pressure sensor if the combination sensor failed to perform.
About the author
James Mielke is the VP Consumer Teardowns at Yole SystemPlus, part of our Yole Group.
He’s focuses on Reverse Costing analysis of electronics, from semiconductor devices to electronic systems. He is working at Austin, SystemPlus office in Texas.
James has been involved with the architectural design of both handsets and semiconductor platforms for more than 20 years. He has held architectural and strategic marketing positions at Freescale Semiconductor and Motorola.
Prior to System Plus, Jim founded and was CEO of Marketeye One, which is the foundation for the consumer teardown division of SystemPlus Consulting.
James earned a BS in Electrical Engineering from the Milwaukee School of Engineering.