SEMI European 3D Summit: Beyond TSV in advanced ICs

SEMI (www.semi.org) announced details about the fourth annual European 3D Summit. “SEMI European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor summit will take place on January 18-20 at Minatec in Grenoble, France.

With 3D now being much more than just TSV and subsequent stacking technologies, the summit has evolved to encompass 3D as part of the whole advanced packaging continuum.

The SEMI European 3D Summit will include a wide scope of 3D integrated circuit topics beyond Through-Silicon-Via (TSV) technology – with presentations on FO-WLP/ e-WLB, Embedded Die, 3D alternative technologies, new “Start-Up Pitch” session, and companion exhibition with the latest 30 products and services: On 18 January, the Market Briefing session will highlight the latest business challenges and opportunities. Featured 3D and packaging industry experts will include McKinsey, System Plus Consulting, TechSearch International, and Yole Developpement. On 19 January, the 3D Packaging for High-Performance session includes CEA-LETI, ATOS and a keynote from Cisco’s Li Li on “Emerging 2.5D and 3D IC Packaging Platforms for System Integration.” In the 3D Integration Strategy for Imaging products session, experts from Invensas, Olympus, Redbelt Conseils, and STMicroelectronics will present. The New Technologies session features experts from ASE, Fraunhofer IIS/EAS, imec, and XFab. The final two sessions cover Key Enabling Technologies and Start-Up Pitches. On 20 January, the focus is on “FO-WLP: 3D Options” with a keynote from Ramakanth Alapati of GLOBALFOUNDRIES, plus presentations from AMKOR, Nanium, and SPTS. The final session is on the Manufacturing of 3D Integrated Products with speakers from ams, AT&S, Mentor Graphics, and Xintec.

SEMI will provide attendees networking opportunities throughout the event. This year, SEMI offers attendees a chance to visit the Minatec Showroom, to learn about the latest innovations being developed in the Grenoble tech hub.

The SEMI European 3D Summit consistently produces a large industry turnout receiving top satisfaction rates (97 percent overall satisfaction rate, 2012-2015). The European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, imec, Scint-X, SPTS, STMicroelectronics and SUSS Microtec.

More information about the program & registration: 3D European Summit

Source: www.semi.org