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WHAT’S IN THE BOX? Desay SV’s IPU03 and IPU04 at a glance

Desay SV still relies on American component suppliers for producing both generations of IPUs (Intelligent Processing Units) and makes sure to take benefits of the latest technology innovations. Automotive OEMs grapple with the challenge of balancing local preferences and the need for high computing power. Let’s explore insights from Yole Group regarding this subject.

IPUs require advanced SoCs (Systems-on-Chip) to achieve higher levels of autonomous driving capability. While Mobileye dominates the ADAS processor market with a 52% share in 2022, both leading companies, NVIDIA and Tesla are emerging as significant players in central processing, collectively holding 15%. China lags behind, with Horizon Robotics accounting for a mere 0.4% of the market share. (Source: Computing and AI for Automotive 2023, Yole Intelligence).

Today, Benjamin Pussat, Baptiste Desbois and Morgan Collin from Yole Group provide a precise and relevant explanation of the evolution of intelligent driving domain controllers through a teardown comparative analysis of three systems from Desay SV:

Highlights from Yole SystemPlus Teardown Tracks

The IPU03 houses the NVIDIA Xavier SoC, built on a 12 nm technology node, whereas the IPU04 integrates the NVIDIA Orin chip with a more advanced technology node (10 nm).The IPU04 is designed as a flexible platform, accommodating one (XPeng G9) or two SoCs (Li Auto L9), with the second IPU04 design being twice as expensive.

From one IPU generation to the next, Desay SV consistently relies on the same set of suppliers: NVIDIA, Infineon Technologies, Micron, Marvell, and Analog Devices. The dependence on foreign component manufacturers, particularly American ones, remains very strong.

As revealed during CES 2024 , Li Auto plans to continue its partnership with NVIDIA for its high-end fleets. The OEM has opted for the DRIVE Thor, NVIDIA’s next-generation SoC, boasting an impressive 2,000 TOPS (trillion operations per second), four times higher than the Orin. However, a shift towards local suppliers, illustrated by the Li Auto L9 Pro using a SoC from Horizon Robotics (128 TOPS), has been observed for mid-level models.

Stay tuned for our next What’s in the box? review!



Yole SystemPlus Automotive Teardown Tracks are the result of detailed physical and costing analyses. They are carried out by experts with academic and industrial backgrounds in the semiconductor domain. Yole SystemPlus Automotive Teardown Tracks offer a clear and fruitful understanding of the technical choices made by the leading manufacturers. It also reveals accurate insights related to manufacturing costs.

The company covers the overall supply chain from the components to the system. Based on daily technical and industrial monitoring, Yole SystemPlus has significant expertise to support innovation.

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About the authors

Benjamin Pussat is a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group. With solid expertise in electronic systems and with a specific focus on automotive systems, Benjamin produces reverse engineering & costing analyses while also working on custom projects for the electronic systems teams. Benjamin identifies and analyzes the overall manufacturing process and determines the technical choices made for the system components. The objectives of this analysis are to understand the structure of the device, identify all the relevant components and determine the final manufacturing cost.

In addition, Benjamin updates internal tools and runs custom training sessions and demos with industrial organizations. He has also published some articles in the press. Prior to Yole SystemPlus, Benjamin worked as an Engineering Technician at SEIA. Benjamin holds a University Diploma in Technology in Electrical Engineering and Industrial Computing (Université de Nantes, France).

Baptiste Desbois serves as Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.

With solid expertise in the analysis and the troubleshooting of electronics boards, Baptiste produces reverse engineering & costing analyses while also working on custom projects for the electronics systems teams. His mission is to identify and analyze the components during the disassembly of the device and cutting of the electronic boards and determine the final manufacturing cost. This will provide the raw information to produce the reverse costing reports.

Prior to Yole SystemPlus, Baptiste worked as a bench test validation technician for Sercel (Nantes, France)

Baptiste holds a BTS Digital Systems Option B: Electronics and Communication and a professional license in mechatronics from E.S.P.R.I.T Campus (Redon, France).

Morgan Collin serves as a Technology & Cost Analyst at Yole SystemPlus, part of Yole Group.

With solid expertise in the analysis of electronics boards, Morgan produces reverse engineering & costing analyses while also working on custom projects for the electronic systems teams. His mission is to identify and analyze the electronic boards and mechanical components of devices during the disassembly process. The objectives of these analyses are to understand the structure of the device, identify all the components, and determine the final manufacturing cost. In addition, he works on the construction of the block diagrams for the different reports and monitors the display software. Prior to Yole SystemPlus, Morgan worked as a production technician, purchasing and stock management, at Fougerolle. Morgan holds a BTS Digital Systems degree (Ecole Jeanne d’Arc, France).



This article has been developed in collaboration with Hugo Antoine, Technology and Market analyst, Computing at Yole Group.




Source: www.yolegroup.com

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