FLASH MEMORY SUMMIT 2022

Despite global challenges, the market will grow over $260B in 2027. Memory demand will remain stubbornly resilient and new solutions will enable relentless technology scaling.

The market will grow to $4.8b by 2027: eflash limitations below 28nm, and the rollout of cxl 2.0 by 2024 will open new opportunities for emerging nvm.

The memory packaging market will grow to $20b in 2026. the ramp-up of chinese memory, the growth of flip-chip dram, and the rise of 3d-stacking technologies are opening significant opportunities for packaging players

Mainstream low-power DRAM physical analysis, technology, and cost comparison: Samsung’s 1z generation, SK hynix’s 1y, and Micron’s 1y.

Physical analysis and cost comparison of three leading-edge 3D NAND technologies: Samsung’s 128-layer, SK Hynix’s 128-layer, and Intel’s 144-layer.

Micron’s triple-level cell 3D NAND with 176 active wordlines using replacement-gate technology to enhance performance.

128-layer 3d nand using xtacking 2.0 architecture designed to increase die density and data processing speed

Fifth generation of bics flash using two tiers and conventional periphery on the side

Quarterly analysis of the DRAM market, historical and forecast, including market pricing, supply data by producer, demand by end-market, plus much more.

Quarterly analysis of the NAND market, historical and forecast, including market pricing, supply data by producer, demand by end-market, plus much more