Advanced packaging: Strong momentum pushed by the giants

Product Related

The top 8 advanced packaging players dominate the market and continue with heavy investment.


  • The advanced packaging industry is expected to have a 9.6% CAGR between 2021 and 2027 to $65 billion.
  • The advanced packaging segment as compared with traditional packaging market continues to increase, with more than 50% of the market by 2027.
  • The highest advanced packaging market share belongs to the Flip-Chip platform, with 70% of the market in 2021. The highest CAGR is expected from ED , 2.5D/3D, and fan-out at 24%, 14%, and 11%, respectively.

The semiconductor supply chain is changing. Companies define their strategies at various levels to adjust to the changing business environment. They are moving all along the supply chain with different business models. They expand the business and explore new areas. The advanced packaging ecosystem is following the same path…

Yole Intelligence, part of Yole Group, has developed comprehensive and in-depth semiconductor packaging expertise for over 20 years. Throughout the year, analysts investigate this industry and deliver their analyses in an extensive collection of technology & market analyses with reports, monitors, and teardowns.

Titre du visuel

june 2021

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Thematic(s) :

Today, Yole Intelligence announces its annual report, Status of the Advanced Packaging Industry. This 2022 edition combines and analyzes the latest news coming from the industry: government investments, collaborations, investments and capability expansion, new technologies, and products. This report also presents a comprehensive analysis of the advanced packaging supply chain and the substrate shortage problem. It includes financial analyses of the Top 30 OSATs, including a breakdown of Chinese OSATs, mergers and acquisitions since 2020, and explanatory scenarios. Detailed strategic analyses of the leading advanced packaging players – including TSMC, Samsung, Intel, ASE – and their technology choices are also delivered in this report

Gabriela Pereira Technology and Market Analyst, Yole Intelligence
At Yole Intelligence, we clearly see the advanced packaging is evolving with the use of front-end tools and technologies. This has allowed giants like TSMC, Intel, & Samsung to enter and seriously invest in the advanced packaging segment, and these players have emerged as the key innovators in the field.

Six players, including 2 IDMs (Intel and Samsung), a foundry (TSMC), and the top 3 global OSATs (ASE, Amkor, JCET), process over 80% of advanced packaging wafers. OSATs accounted for 65% of the advanced packaging wafers in 2021. Foundries are taking advanced packaging business from OSATs with 14% and IDMs with 21%.

IC substrate and PCB manufacturers, including SEMCO, Unimicron, AT&S, and Shinko, are entering the advanced packaging arena. They offer panel-level fan-out packages and embedded dies (and passives) in organic substrates in response to the accelerated adoption of fan-out packaging. These players are taking advantage of their substrate manufacturing know-how, panel line and equipment availability, and thin RDL technology development.

On the other hand, OSATs are expanding their testing expertise, while traditional pure test players are investing in packaging & assembly capabilities. Top OSATs are investing in IC testing capacity to capture the test market, and pure test houses, such as KYEC and Sigurd Microelectronics, are adding packaging/assembly capabilities in their service offering through M&As or investing in R&D.

Overall, there is a paradigm shift in the packaging / assembly business, traditionally the domain of OSATs & IDMs. Players from different business models, foundries, substrate/PCB suppliers, and EMS/ODMs are entering packaging & assembly, cannibalizing the OSAT business.

Substrates have been in tight supply due to strong demand for high-end CPUs, GPUs, and 5G networking chips by major chipmakers. The COVID-19 pandemic, high inflation, and geopolitical tensions are continuing to negatively impact material supplies. The delivery lead time of ABF substrates has been extended to nearly three quarters from 4-5 months due to demand growth outpacing capacity expansion, and prices have risen from 15% to 25%.

Yik Yee Tan PhD. Senior Technology and Market Analyst at Yole Intelligence
Substrate suppliers are investing significant CapEx for needed capacity expansion. Indeed, they are trying to secure the supply for customers with whom they already hold long-term agreements. Nevertheless, at Yole Intelligence, we see that it will take some time before this capacity comes online, and, therefore, the supply constraints are expected to continue throughout 2022 and for another 2 to 3 years.


Yole Group is proud to collaborate with the Chip Integration Technology Center (CITC) to organize the highly exciting Forum on packaging technologies for photonic, RF, and power electronics applications. It will take place on November 30, 2022. The program will be available soon. Stay tuned!

Do not miss the opportunity to exchange views with key players in the packaging industry and meet Yole Intelligence’s experts. More info.!

Yole Intelligence’s semiconductor packaging team invites you to follow this industry at Stay tuned!

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