CHIPLET SUMMIT 2023
Yole group is part of the First Annual Chiplet Summit!
Chiplets are quickly becoming a favorite solution for overcoming the immediate and future challenges of further IC scaling. As a manufacturing and integration strategy, chiplets present new market opportunities for IC vendors, IP and EDA tool suppliers, foundries and OSATs, and will even create the possibilities for new markets.
Our Press Release, read more HERE
FIND US IN THE PROGRAM
Tom HACKENBERG,
Principal Analyst,
Computing and Software
Yole Intelligence part of Yole Group
John LORENZ,
Senior Technology & Market Analyst,
Computing and Software
Yole Intelligence part of Yole Group
They will present at the following:
Wednesday, January 25th,
Session: Chiplets: where we are today
09:00am – 10:00am: Chiplets Market Update
Thursday, January 26th,
Panel: Chiplets in 2028 and How We Got There
03:30pm – 04:30pm
DO NOT MISS OUR LATEST PRODUCTS RELATED TO THE TOPIC!
Yole Group publishes several products on Market Trends, Technology, Process & Cost innovations related to the event topics. Let’s find more below…
MARKET MONITORS
Consumer demand weakness is making an impact the cpu and gpu markets, as chiplet and ai innovation continue apace.
In 2022, top players’ capital expenditure has grown 7% to reach $14.5b, strengthening their position in the advanced packaging market
2022 1h over-supply created pessimism in the mcu market, but 2h performed unexpectedly well. inflation still looms but sets a cautious view for 2023
ANNUALS REPORTS
High-performance computing and adas are driving the growth of 3d performance packaging, requiring a development platform for new technologies and reaching $7.87b in 2027
Imaging radar will drive the next growth wave and reach $4.3b by 2027, equating to 30% of the total radar market
product to discover IN 2023…
Chiplet and High-end performance Packaging 2023
This report focuses on market and technology trends of most expensive, most advanced AP platforms dedicated to high-end performance applications and achieved by means of chiplet and heterogenous integration using AP platforms such as 2.5D Si interposer, 3D stacking (3D stack memory and 3D SoC), Embedded Si Bridge (EB), Ultra High Density FO (UHD FO) and new in 2023, co-packaged optics aspects. Listed AP platforms differ in their component applications, average selling price and supply chain. Hence, this report provides information for all AP platform types used for chiplet and heterogenous integration: 5-year market forecast (revenue, units and wafer start), manufacturer data (revenue, market share, CapEx), roadmaps, supply chain, industry news, mature and emerging technologies.
Industry Insights Articles:
PRESS RELEASE
Where does radar sit in the ADAS architecture centralization?
The road to autonomy requires more performant sensors and a more centralized architecture.
Read more…
PRESS RELEASE
A myriad of players want their slice of the computing & AI market for data center.
Data center processor diversification is ongoing with AI co-processing & DPU acceleration.
Read more…
A QUESTION?
Feel free to meet your onsite sales contact for any matter!
Jeff PERKINS
Executive Vice President & General Manager, Yole Inc.
jeff.perkins@yolegroup.com
