Tradeshows & Conferences
ADVANCED PACKAGING MARKET EVOLUTION & MATERIAL SOLUTION
Driven by generative AI and HPC, cutting-edge package architectures present new challenges requiring new material solutions
Join us for an insightful online event hosted by our partner, Henkel, as we delve into the dynamic realm of advanced packaging market evolution and innovative material solutions. In an era propelled by generative AI and HPC (High-Performance Computing), cutting-edge package architectures present unprecedented challenges, demanding novel material solutions to match the pace of technological advancement.
In this exclusive webinar, industry experts will convene to explore the rapid evolution of the advanced packaging market. Speakers, including Gabriela Pereira, Raj Peddi and Kail Shim, will delve into key insights, shedding light on the latest trends, market projections, and technological advancements shaping the landscape.
Join Yole group at this webinar to gain invaluable insights into the latest advancements and trends shaping the advanced packaging landscape.
Related products:
Related articles:
Yole Group will be part of the program with:
Gabriela Pereira
Technology & Market Analyst, Semiconductor Packaging
Monday, May 20th
10am: Advanced packaging market evolution driven by generative AI & HPC
ABSTRACT:
The advanced packaging market revenue is expected to grow at a 10.7% CAGR from $37.8B in 2023 to $69.5B by 2029. After an economic downturn affecting the entire semiconductor industry, the market is set to recover in 2024 as demand increases and adoption of advanced packaging keeps growing. The advanced packaging market is being strongly driven by the megatrends of HPC and generative AI, and within all packaging platforms, 2.5D/3D packaging is the one growing at the fastest rate. 2.5D/3D unit shipments for data center AI processors are expected to grow strongly, at a CAGR23-29 of 23%. This is propelled by the massive growth of data center AI chips and the need for more bandwidth, speed, high-end memory, and lower power consumption. As Moore’s Law is decelerating and die cost is growing, chiplet adoption is gaining interest, and the industry relies on advanced packaging as the solution to realize heterogeneous integration. Industry giants, including TSMC, Intel, Samsung, OSATs like ASE, Amkor, and JCET, as well as others, are strongly investing in high-end advanced packaging capacity and together are expected to invest ~$11.5B in 2024 for their advanced packaging businesses.
Kail Shim
Application Engineering Manager
Kail Shim is the Application Engineering Manager for Henkel’s Semiconductor Advanced Packaging Electronics business.
He has more than 22 years of experience in semiconductor packaging and electronic materials and had involved in many semiconductor packaging materials development like TC NCP, NCF, Capillary underfill, liquid compression mold and lid attach material during his long tenure at the company. he holds a bachelor’s degree in Semiconductor engineering from the InHa University in Korea. He is based in Henkel’s Irvine, California facility.
Raj Peddi
Market Strategy Manager
Raj Peddi is the Market Strategy Manager for Henkel’s Semiconductor Packaging Electronics business.
In his long tenure at the company, Raj has held roles in technical customer service, engineering, and marketing. He has more than 25 years of experience in semiconductor packaging and electronic materials and has previously worked for other well-known industry leaders, including Honeywell and Motorola. Raj holds a master’s degree in chemical engineering from the University of Illinois Chicago and an MBA from Pepperdine Graziadio School of Business and Management. He is based in Henkel’s Irvine, California facility.
Gabriela Pereira
Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the Manufacturing & Global Supply Chain activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
Building on a strong legacy of more than 145 years, we are leading the way to reimagine and improve life every day. Today and for generations to come. Through our innovative and sustainable brands and technologies, across our teams around the world. Henkel holds leading positions in both industrial and consumer businesses: Our portfolio includes well-known hair care products, laundry detergents, fabric softeners as well as adhesives, sealants, and functional coatings.
