Market and Technology Trends

Status of the Advanced Packaging 2023

By Yole Intelligence

Geopolitical tensions are making AP even more crucial. Supply chain diversification and constraints are shaping a market expected to reach 78B$ by 2028 with 10.6% CAGR22-28


Key Features​

  • The Advanced Packaging industry attained a market value of $44.3 billion in the year 2022. This market is expected to surpass $78 billion by 2028, showcasing a CAGR of 10% during the period from 2022 to 2028.
  • The largest market in 2022 was the 'Mobile & Consumer' sector, which accounted for more than 70% of the total revenue. However, it is expected that this share will decrease to 61% by 2028 as the 'Automotive' and 'Telecom & Infrastructure' sectors gain larger market shares. These two sectors are projected to be the fastest-growing markets by 2028, with respective CAGRs of 17% and 10%.
  • In terms of packaging technologies, the primary contributors to the market are flip-chip, 2.5D/3D, and SiP, which are expected to hold a combined market share of over 90% by 2028. Additionally, the top three platforms experiencing the highest growth rates are ED, 2.5D/3D, and flip-chip.

What’s new? 

  • New technology platforms added
  • New assumptions
  • Forecast updated


Product objectives

The “Status of the Advanced Packaging Industry” is a yearly overview report. The objectives of the report are:

  • Advanced Packaging market overview 
  • Drivers and dynamics
  • Future applications
  • Disruptions and opportunities
  • Supply chain analysis
  • Overview of production by player (IDM, OSAT, foundry)
  • Shifting business models
  • Financial analysis of TOP 30 OSATs
  •  Technology trends and forecasts
  • Revenue, wafer, and unit forecasts by platform
  • Future development by platform
  • Impact of front-end scaling
  • Scaling and functional roadmaps



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