ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool. The Ultra Fn A system adds thermal atomic layer deposition (ALD) to ACM’s extensive list of supported furnace applications. The company also announced that it has shipped the first Ultra Fn A furnace tool to a top-tier China-based foundry manufacturer. The product is expected to be qualified in 2023.
“As logic nodes continue to shrink, customers are increasingly looking for suppliers that are willing to collaborate to meet their advanced process requirements, like ALD,” said David Wang, CEO and president of ACM. “ALD is one of the fastest growing applications for manufacturing at advanced nodes, making it a critical new capability for our furnace portfolio. ACM’s deep understanding of the entire semiconductor manufacturing process and our innovative capabilities allow us to quickly develop new applications – wet and dry – to meet emerging market requirements. Our new ALD tool builds on our extensive furnace platform, which also includes support for atmospheric, low-pressure and ultra-high vacuum furnace options.”