Adeia and Qorvo enter into hybrid bonding license agreement

Adeia (“Adeia” or the “Company”), the company whose patented innovations enhance billions of devices, announced that Qorvo, a global provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology.

“Semiconductor industry leaders are looking to 3D structures, packages and interconnect innovations to elevate performance and expand functionality on miniaturized footprints,” said Dana Escobar, chief licensing officer and general manager, semiconductor, for Adeia. “Hybrid bonding technology introduces new opportunities to optimize the architecture of the RF front-end semiconductor devices and modules to enhance functionality, performance and size of the solutions.”

Adeia has pioneered fundamental advances in the semiconductor industry over the last 30 years. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with semiconductor companies around the world to enhance product roadmaps.