Market and Technology Trends
High-End Performance Packaging 2024
By Yole Intelligence —
This report is scheduled for Q2 2024
YINTR24413
THIS TABLE OF CONTENTS IS FROM THE PREVIOUS EDITION - IT MIGHT BE UPDATED.
Table of contents
Glossary
About the authors
Objectives of this report
Key features of this report
Companies cited
Who should be interested in this report?
What we got right, what we got wrong
Methodology and definition
3-Page summary
Executive summary
Introduction
- Moore’s law
- Performance Demand in Semiconductor
- High-end performance packaging definition
- Scope of the report
- Type of high-end performance packaging
Market forecasts
- Package ASP update split by technology
- Market revenues - Split by end-market and technology
- Market units - Split by end-market and technology
- Market size split by technology
- 3D SoC
- 3D Stacked memory
- RDL Interposer
- 2.5D Interposer
- Embedded Si bridge
- Chapter conclusion
This report focuses on market and technology trends of most expensive, most advanced AP platforms dedicated to high-end performance applications and achieved by means of chiplet and heterogenous integration using AP platforms such as 2.5D Si interposer, 3D stacking (3D stack memory and 3D SoC), Embedded Si Bridge (EB), Ultra High Density FO (UHD FO) and new in 2023, co-packaged optics aspects. Listed AP platforms differ in their component applications, average selling price and supply chain. Hence, this report provides information for all AP platform types used for chiplet and heterogenous integration: 5-year market forecast (revenue, units and wafer start), manufacturer data (revenue, market share, CapEx), roadmaps, supply chain, industry news, mature and emerging technologies.
This report focuses on market and technology trends of most expensive, most advanced AP platforms dedicated to high-end performance applications and achieved by means of chiplet and heterogenous integration using AP platforms such as 2.5D Si interposer, 3D stacking (3D stack memory and 3D SoC), Embedded Si Bridge (EB), Ultra High Density FO (UHD FO) and new in 2023, co-packaged optics aspects. Listed AP platforms differ in their component applications, average selling price and supply chain. Hence, this report provides information for all AP platform types used for chiplet and heterogenous integration: 5-year market forecast (revenue, units and wafer start), manufacturer data (revenue, market share, CapEx), roadmaps, supply chain, industry news, mature and emerging technologies.