Show Daily powered by Optics.org – Yole Group is fully part of Photonics West 2023, from January 28 to February 02 2023 in San Francisco. This event is where the latest advances are shared by the optics and photonics community in lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics. This year, Yole Group’s analysts have taken part to three sessions:
3D Sensing for Consumer Applications
MicroLEDs for Consumer Applications
Co-Packaged Optics and Silicon Photonics for Data Center Applications
In this occasion, Optics.org published a daily coverage of the optics & photonics industry and the markets that it serves, including Yole Group‘s analysts exclusive interviews:
3D SENSING BECKONS FOR LONGERWAVELENGTH EDGE-EMITTERS
Ali Jaffal, Ph.D,
Technology & Market Analyst, Compound Semiconductor, Yole Intelligence part of Yole Group
The transition to a bigger display area in the smartphone is the core motivation for the move from GaAs VCSELs to InP EELs. Apple’s iPhone roadmap confirms the committed development to enlarge the screen to the total size of the phone, by reducing first the current notch (for imaging, proximity sensor, flood illuminator, and dot projector functionalities) to a smaller pill-shaped hole and then to a tiny punch-hole…
MICROLED DISPLAYS: APPLICATIONS EMERGE BUT MAJOR MANUFACTURING CHALLENGES REMAIN
Eric Virey, Ph.D.,
Principal Analyst, Display, Yole Intelligence part of Yole Group
There is no commonly accepted definition for microLED. Size alone is not sufficient. Some refer to microLEDs as any chip with a size below 100 microns. Others consider 50 microns or sometimes 30 microns to be the limit. At Yole Intelligence, we define microLEDs by a combination of size, die architecture, manufacturing technology, and application…
MAJOR PLAYERS LOOK TO BUILD BANDWIDTH WITH CO-PACKAGED OPTICS
Martin Vallo, Ph.D.,
Senior Analyst, Photonics, Yole Intelligence, part of Yole Group
The term co-packaged optics (CPO) is today widely used for multiple things within datacenter technologies and use cases. That may cause communication misunderstandings. However, standards bodies OIF (Optical Internetworking Forum) and COBO (Consortium for On-Board Optics) are intensively working on the applications classification and building a consistent terminology…
Ali Jaffal, Ph.D, Technology & Market Analyst, Compound Semiconductor, Yole Intelligence part of Yole GroupThe transition to a bigger display area in the smartphone is the core motivation for the move from GaAs VCSELs to InP EELs. Apple’s iPhone roadmap confirms the committed development to enlarge the screen to the total size of the phone, by reducing first the current notch (for imaging, proximity sensor, flood illuminator, and dot projector functionalities) to a smaller pill-shaped hole and then to a tiny punch-hole…
