WHAT’S IN THE BOX? XPENG’s G9 ADAS and G6 electrification systems at a glance

Ranked 46th among all Chinese car OEMs, XPENG has risen to 9th place among EV manufacturers. The premium OEM remains a minor player with 140,000 vehicles sold in 2023, while BYD’s EV segment is ten times larger. To play its part in this market which has seen numerous pure EV manufacturers emerging in recent years (Zeekr, ArcFox, Nio…), XPENG relies not only on local incentives but also on international partnerships.

Recently, the company announced an “Electrical/Electronic Architecture Technical Collaboration” with Volkswagen. The jointly developed E/E Architecture is set to equip Volkswagen brand electric vehicles made in China from 2026. This partnership opens up the Chinese EV market for one party, while facilitating the acquisition of manufacturing skills for the production of small cars in high volumes for the other.
Such partnerships, also aimed at sharing development efforts and costs, are becoming increasingly common. Stellantis and Leapmotor have just signed an agreement to design and manufacture EVs based on Leapmotor’s electrification platform and chassis in Europe. Additionally, discussions between Nissan and Honda are underway to explore potential future collaborations.

Over the last few months, Benjamin Pussat, Guillaume Robichon and Philippe Vandar, Technology & Cost Analysts from Yole Group, have carried out thorough cost and technological analyses of the embedded systems in the XPENG G9 and G6 models. Today, our experts bring out the key findings from the: 

The XPENG G9 is equipped with the RS-LiDAR-M1 developed by RoboSense, the second-leading LiDAR manufacturer after Hesai. The system is a 2D MEMS scanner, part of the hybrid solid-state LiDAR category. It incorporates five optical modules, each containing an OSRAM IR laser diode and a SiPM (silicon photomultiplier) from Hamamatsu, enabling object detection within a 200 m range. The MEMS components are internally manufactured. Through meticulous optical module alignment, the system achieves minimal offset in object detection.

The manufacturer of the DMS installed in the G9 was not identified. The in-cabin camera houses a CIS (CMOS image sensor) from onsemi with a rolling shutter readout and a resolution of 1 Mp. This sensor has been observed in other teardowns (the LCE DMS for Nio ET5 ET7 and the Desay SV for LEVC TX4), which are also available on our website.

Desay SV’s IPU04 supports ADAS functions thanks to the ultra-high computing power delivered by the NVIDIA Orin SoC. Outperforming its predecessor, the Xavier chip, Orin operates on a more advanced 10 nm technology node and features 254 TOPS (trillion operations per second). The IPU04 design allows for a second Orin chip, as already observed in the Li Auto L9.

Similar to the G9, the G6 model operates on an 800 V platform. Powertrain design reflects OEM strategies on two fronts: increased system integration and the use of SiC-based devices. The G6 combines a 3-in-1 e-axle unit from Inovance Automotive – comprising an inverter, motor and gearbox – alongside a Combo System (on-board charger and DC-DC converter) provided by SHINRY. Both the inverter and the Combo System include SiC electronics, packaged as a module by Infineon in the former, and as discrete components from Cree (now Wolfspeed) and STMicroelectronics in the latter. The power board within the Combo System also includes Si MOSFETs supplied by STMicroelectronics.

Inovance Automotive and SHINRY rely on the same foreign Tier 2 suppliers for the processing, CAN and sensing components, with Infineon, NXP, and Allegro being the chosen partners respectively.

According to Yole Group, the power module constitutes 76% of the total inverter manufacturing cost (excluding the cost of the aluminum 3-in-1 system casing). In the case of the Combo System, the overall cost of power devices is assessed at 29%, with 17% attributed to SiC transistors and 12% to Si MOSFETs.

After several x-in-1 Chinese electrification system teardowns, Yole Group is eager to identify a European counterpart for detailed analysis. Apart from Valeo, which showcased its 6-in-1 e-axle last September at IAA Mobility in Munich, there is a shortage of candidates, reaffirming Chinese dominance in this field.

Stay tuned for our next What’s in the box? review!

Yole SystemPlus Automotive Teardown Tracks are the result of detailed physical and costing analyses. They are carried out by experts with academic and industrial backgrounds in the semiconductor domain. Yole SystemPlus Automotive Teardown Tracks offer a clear and fruitful understanding of the technical choices made by the leading manufacturers. It also reveals accurate insights related to manufacturing costs.

The company covers the overall supply chain from the components to the system. Based on daily technical and industrial monitoring, Yole SystemPlus has significant expertise to support innovation.

Benjamin Pussat is Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, he is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, Benjamin contributes to the construction of block diagrams.

He has developed a specific expertise in Electrification modules encompassing inverters, converters, as well as ADAS solutions. Additionally, he conducts analyses centered on consumer products like smartphones. Moreover, Benjamin plays a significant role in developing and maintaining Yole Group’s PCB costing software. He also leads custom training sessions and demonstrations. And he has also published numerous Yole Group’s articles focused on systems teardown.

Prior to Yole Group, Benjamin worked as an Engineering Technician & Test Technician. Benjamin holds a University Diploma in Technology in Electrical Engineering and Industrial Computing (Université de Nantes, France).

Guillaume Robichon serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, he is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, Guillaume contributes to the construction of block diagrams.

He has expertise in various systems, including ADAS, radars, as well as Electrification, Infotainment, and Telematics modules for automotive applications. He also conducts analyses focused on consumer products such as smartphones, smartwatches, and routers. And he has also published numerous Yole Group’s articles focused on systems teardown. Furthermore, he plays a key role in developing and updating Yole Group’s display costing software.

Guillaume holds a University Diploma in Technology in Electrical Engineering and Industrial IT from Nantes University (France).

Philippe Vandar serves as an Analyst, Systems Teardown at Yole Group.

With his expertise in reverse engineering and costing analyses, Philippe is responsible for identifying and dissecting electronic boards and mechanical components during the disassembly process. His primary objectives include understanding device structures, identifying components, and determining manufacturing costs. Additionally, he contributes to the construction of block diagrams.

Philippe has expertise in various systems, including ADAS, as well as Electrification, Infotainment, and Telematics modules for automotive applications. Additionally, he conducts analyses focused on consumer products such as smartphones and smartwatches. And he has also published numerous Yole Group’s articles focused on systems teardown. Furthermore, Philippe is instrumental in developing and enhancing Yole Group’s display costing software. Prior to joining Yole Group, he served as an electronic auto parts cost analyst at STELLANTIS (formerly the PSA Group).

Philippe holds a Advanced Technician Diploma in Mechanics and Industrial Automation (BTS) from MECAGIM school (France).

This article has been developed in collaboration with Pierrick Boulay, Senior Technology & Market Analyst, Automotive Semiconductors at Yole Group.



Source: www.yolegroup.com