Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd.
Dr. Koen Kennes from imec is copresenting with Brewer Science, Process challenges during CVD oxide deposition on the backside of 20-µm thin 300-mm wafers temporarily bonded to glass carriers, which evaluates a temporary carrier system during several backside processing steps on thin wafers down to 20 µm. The main focus is the impact of various chemical vapor deposited (CVD) oxides on thinned wafers supported by temporary bonding materials. Such wafers have the risk of deformation and even delamination during the deposition step. The presentation is May 31st at 10am, a part of Session 37: Interactive Presentations.
A step-by-step investigation reveals the deformation/delamination mechanism to be highly dependent on the oxide deposition conditions rather than the deposition temperatures. Controlling the stress in the oxide layer enables both high-temperature and low-temperature oxides to be successfully deposited on the backside of ultrathin wafers. The experimental results are corroborated with finite element simulations.
“During high-temperature CVD oxide deposition on thinned wafers on temporary carriers, delamination of the thin wafer from the carrier was observed.” States Dr. Kennes, R&D team lead for bonding, assembly, and wafer-level packaging at imec. “Using FEM simulations and DOE experiments, the failure mechanism was identified, and process solutions were defined. This resulted in successful damascene processing on the backside of thinned wafers on glass carriers.”