Rising demand for SiC chips: Bosch plans to acquire U.S. chipmaker TSI Semiconductors

Plans to invest 1.5 billion USD in strategically important semiconductor business for electromobility.

  • Bosch chairman Dr. Stefan Hartung: “With this planned investment in the U.S., we are also increasing our semiconductor manufacturing, globally.”
  • Third pillar for semiconductor business: following Reutlingen and Dresden in Germany, Bosch will in the future also make chips in Roseville, California.
  • More chips: with the planned acquisition, Bosch will significantly expand its global portfolio of SiC semiconductors by the end of 2030.
  • Electric cars as the driving force: SiC chips enable greater range and more efficient recharging.

Bosch is expanding its semiconductor business with silicon carbide chips. The technology company plans to acquire assets of the U.S. chipmaker TSI Semiconductors, based in Roseville, California. With a workforce of 250, the company is a foundry for application-specific integrated circuits, or ASICs. Currently, it mainly develops and produces large volumes of chips on 200-millimeter silicon wafers for applications in the mobility, telecommunications, energy, and life sciences industries. Over the next years, Bosch intends to invest more than 1.5 billion USD in the Roseville site and convert the TSI Semiconductors manufacturing facilities to state-of-the-art processes. Starting in 2026, the first chips will be produced on 200-millimeter wafers based on the innovative material silicon carbide (SiC).