Takeaway trends from European MEMS & Sensors Summit

Article written by Heidi Hoffman for SEMI BLOG – Data management tools need to become whip-smart, multi-sensor packages are the real deal, and a renewed emphasis on safety has thrust ADAS sensor systems into the spotlight. These were among the latest industry insights served up to the more than 400 MEMS, imaging and other sensor industry professionals from 21 countries who massed September 19-21 in Grenoble, France, to learn, network and share updates during SEMI-MSIG’s European MEMS & Sensors Summit and Imaging & Sensors Summit. Read on for more detail on each of these topics.

 1. The industry must drive advancements in data management tools – including AI – to manage data streams from advanced sensors and sensor systems.

Managing artificial intelligence (AI) data and mining it for actionable insight gleaned from the sensors – including a deluge from improving machine vision systems – is necessary to drive adoption and integration of sensor hardware. Whether in cars, for security applications, or simply adjusting the thermostat based on how many people are in the room, intelligence is necessary – and a wrong answer is unacceptable.

Evgeni Gousev from Qualcomm noted that, driven largely by privacy concerns, data processing (intelligence) will get closer to the edge than previously thought. In wearables, according to Peter Weigand of Bosch, that means software better suited to manage power more efficiently, faster adaptation to individual behaviors, as well as greater accuracy and more functionality. Mark-Eric Jones from Leman Microdevices noted that for AI to fulfil its promise in healthcare, it must be fed huge quantities of accurate data.

2. Multi-sensor packages have arrived!

A few years ago, sensor fusion was recognized by MSIG as a promising development that would expand capabilities and enhance sensor sensitivity and accuracy. Given the presentations and discussions at the Summit, that promise has been met and multi-sensor packages are living up to the hype. Several products combining sensors into one package with connected control and data systems – rather than as discrete elements – were showcased.

Adding another dimension (pun intended), 3D stacking and process and materials development are moving into volume applications to enable greater speeds and enhance capabilities for sensor modules. Companies taking advantage of 3D stacking and sensor fusion designs are gaining market share based on both volume and revenue forecasts. IHS Markit, Bosch Sensortech, On Semiconductor, Infineon and several other companies illustrated their work, while highlighting strong customer adoption… Full article

Source: www.semi.org