Market and Technology Trends

Fan-Out Packaging 2023

By Yole Intelligence

Fan-out packaging market is expected to reach $3.8B by 2028, driven by the adoption of ultra-high-density packages for HPC and networking markets.


Key Features

  • 2018-2028 market forecast in package units, revenues ($M), and wafer production volumes.
  • Market forecast by end-market and market class (Core FO, HD FO, UHD FO).
  • Average Selling Price analysis, per market class.
  • Market shares ok key manufacturers.
  • Market shares by business model and by competitive technologies.
  • Supply chain analysis with a focus on China’s fan-out landscape.
  • Technologies trends and new commercialized products.
  • Fan-Out Panel Level Packaging, including area and cost effiency analysis.

Product objectives

  • To identify and describe which technologies can be classified as ‘Fan-out packaging’ and define market classes
  • To analyze key market drivers, benefits and challenges of fan-out packages for the different applications
  • To describe the different existing technologies, their trends and roadmaps
  • To analyze the supply chain and fan-out packaging market landscape
  • To provide a market forecast for the coming years, and estimate future trends

Fan-out packaging markets are studied through the following analyses:

  • Top-down model based on end-system demand and market valuations based on top-down and bottom-up models
  • Market share based on production projections
  • Supply value chain analysis
  • State-of-the-art technologies and trends
  • End-user adoption for the various applications
  • Transition from Fan-Out Wafer-Level Packaging to Fan-Out Panel Level Packaging

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